Development Kits

Digi XBee3 Cellular Smart Modem LTE-M/NB-IoT Development Kit (NB-IoT)
Manufacturer: Digi International
MPN: XK3-C-N1-UT-E
Includes:
  • 1 Digi XBee3 Cellular LTE-M/NB-IoT embedded modem
  • 1 Digi XBee3 development board
  • Antennas and power supply
132,62 EUR
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Digi XBee3 ZigBee Mesh Kit, worldwide
Manufacturer: Digi International
MPN: XK3-Z8S-WZM
Includes:
  • 3 Digi XBee Grove Development Boards
  • 3 Digi XBee3 ZigBee SMT Modules
  • 3 Micro-USB Cables
  • 3 Antennas
82,00 EUR
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Qualcomm Smart Audio Dev Kit with Acoustics
Manufacturer: Qualcomm
MPN: DK-SMART-AUDIO-APQ8009-0-A
  • Wi-Fi certified SoM featuring the APQ8009 processor and containing key system components
  • Best in class connectivity with 2x2 MIMO 802.11ac, Bluetooth® 4.2 with profiles such as A2DP (SBC, AAC, MP3, aptX), HFP and AVRCP
  • High-quality Bluetooth/Wi-Fi coexistence through separate Bluetooth and Wi-Fi signal paths
  • Reference speaker casing with bi-amped, two-way speakers
712,08 EUR
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SX-SDCAC-2830-SP - Evaluation card for SX-SDMAC
Manufacturer: Silex Technology
MPN: SX-SDCAC-2830-SP

The Silex SX-SDCAC SD card form factor is a next generation 802.11a/b/g/n/ac plus Bluetooth SDIO card based on the QCA9377 System-on-Chip (SoC) with Link rate upto 433 Mbps (1x1).
36,94 EUR
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SX-SDCAC-2832+-SP - Evaluation Card for SX-SDMAC+
Manufacturer: Silex Technology
MPN: SX-SDCAC-2832+-SP

The Silex SX-SDCAC Plus is a next generation 802.11a/b/g/n/ac plus Bluetooth SDIO card based on the QCA9377-3 System-on-Chip (SoC). The SX-SDCAC Plus is mechanically designed in a SD card form factor to provide customers with a vendor independent form factor.
36,05 EUR
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DEV KIT QCC5121
Manufacturer: Qualcomm
MPN: DK-QCC5121-WLCSP81-A-0

Development Kit for the Qualcomm QCC5121 Bluetooth Audio SoC
712,08 EUR
zzgl. 19% MwSt. zzgl. Versand
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DEV KIT QCC3026
Manufacturer: Qualcomm
MPN: DK-QCC3026-WLCSP81-A-0

Development Kit for the Qualcomm QCC3026 Bluetooth Audio SoC
712,08 EUR
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