Wireless Connectivity

Manufacturer: Sierra Wireless
MPN: BX3100 Dev Kit

• Wi-Fi and Bluetooth 4.2 pre-certified module
• Simple and fast integration with free unlimited FOTA and built-in cloud connectivity
• Ideal for quickly and cost effectively adding wireless communication

Manufacturer: Sierra Wireless
MPN: BX3105 Dev Kit

• Wi-Fi and Bluetooth 4.2 pre-certified module
• Simple and fast integration with free unlimited FOTA and built-in cloud connectivity from AirVantage®
• Module supports 802.11 b/g/n and dual-mode Bluetooth Classic and Bluetooth Low Energy 
• Designed in an industrial-grade common flexible form factor (CF3®)

Manufacturer: Digi International
MPN: A08-HABUF-P5I

• 868 MHz
• Half-wave dipole (2.1 dBi)
• 5" pigtail to U.FL female

Manufacturer: Quectel Wireless Solutions
MPN: BG96MATEA-128-SGN

Adapterboard for QCT-UMTS

Manufacturer: Digi International
MPN: XKC-M5T-W

Digi XBee Cellular 3G embedded modems provide a simple path to 3G (HSPA/GSM) with 2G fallback connectivity for OEMs with worldwide deployments. This modem is FCC/ IC, PTCRB, and AT&T certified which completely eliminates the cost, complexity, and risk involved in the certification process.

Manufacturer: Quectel Wireless Solutions

Manufacturer: Quectel Wireless Solutions
MPN: EC21-EFA-MINIPCIE

The EC21 is an LTE category-1 module optimized specially for M2M and IoT applications. It delivers power-enhanced performance and M2M-optimized speeds of 10Mbit/s downlink and 5Mbit/s uplink, and features low-power, low-cost LTE connectivity.

Manufacturer: Quectel Wireless Solutions
MPN: EC25-EFA-MINIPCIE

The EC25 series is the new generation of LTE category-4 module, optimized specially for M2M and IoT applications. Adopting the 3GPP Rel. 10 LTE technology, it delivers 150Mbps downlink and 50Mbps uplink data rates and is fallback compatible with UMTS/HSPA+ UC20 module and multi-mode LTE EC20 module in the compact and unified form factor, providing a flexible and scalable platform for migrating from UMTS/HSPA+ to LTE.