
Qualcomm - IQ-8275
Qualcomm - IQ-8275
The Qualcomm IQ8 Series powers compute-heavy and AI-based devices and is designed to operate in an expanded temperature range. It features built-in safety functions and rich peripheral support, ensuring powerful and efficient workload processing in demanding industrial environments.
Enhanced by on-device AI, the Qualcomm IQ8 Series delivers industrial-grade AI performance of up to 40 TOPS, an octa-core Qualcomm® Kryo™ Gen 6 CPU, a powerful Qualcomm® Adreno™ 623 GPU, and support for up to 12 concurrent cameras, as well as 4K video encode and decode across multiple displays. It also includes a dedicated safety island or real-time subsystem and can operate in extreme industrial conditions ranging from -40°C to +125°C, making it ideal for a wide range of intelligent, reliable, compute-heavy industrial applications.
Features:
- Integrated Qualcomm® Hexagon™ Tensor Processor with Hexagon DSP, a quad Hexagon Vector eXtensions (HVX) processor, and dual Hexagon Matrix eXtensions (HMX) coprocessors, delivering up to 40 TOPS to support high-performance, AI-centric, and generative AI industrial use cases.
- Multi-OS support for the Qualcomm® Linux® software stack and Ubuntu.
- Safety features to support safety goals, including support for ECC (Error Correction Code) memory and a dedicated safety island with real-time cores.
- Designed for use in extremely harsh industrial environments with a wide operating temperature range of -40°C to +125°C.
- Adreno Video Processing Unit (VPU) 623: Fifth-generation Ultra HD video processing unit for high-quality 4K video encode (up to 4K85) and decode (up to 4K135). Includes native decode support for HEVC, H.265, H.264, AV1, and VP9, as well as native encode support for HEVC, H.265, and H.264.
- Octa-core processor with four high-performance CPU cores, four efficiency CPU cores, a GPU, and a Hexagon Tensor Processor with vector and matrix extensions to manage various concurrent compute and AI workloads.
- Rich in peripherals, including integrated Ethernet with TSN, PCIe, Wi-Fi, Bluetooth, and USB.
- Built-in MCU subsystem that can replace or enhance external MCUs, offering design flexibility and reduced BOM costs.
The Qualcomm IQ8 Series powers compute-heavy and AI-based devices and is designed to operate in an expanded temperature range. It features built-in safety functions and rich peripheral support, ensuring powerful and efficient workload processing in demanding industrial environments.
Enhanced by on-device AI, the Qualcomm IQ8 Series delivers industrial-grade AI performance of up to 40 TOPS, an octa-core Qualcomm® Kryo™ Gen 6 CPU, a powerful Qualcomm® Adreno™ 623 GPU, and support for up to 12 concurrent cameras, as well as 4K video encode and decode across multiple displays. It also includes a dedicated safety island or real-time subsystem and can operate in extreme industrial conditions ranging from -40°C to +125°C, making it ideal for a wide range of intelligent, reliable, compute-heavy industrial applications.
Features:
- Integrated Qualcomm® Hexagon™ Tensor Processor with Hexagon DSP, a quad Hexagon Vector eXtensions (HVX) processor, and dual Hexagon Matrix eXtensions (HMX) coprocessors, delivering up to 40 TOPS to support high-performance, AI-centric, and generative AI industrial use cases.
- Multi-OS support for the Qualcomm® Linux® software stack and Ubuntu.
- Safety features to support safety goals, including support for ECC (Error Correction Code) memory and a dedicated safety island with real-time cores.
- Designed for use in extremely harsh industrial environments with a wide operating temperature range of -40°C to +125°C.
- Adreno Video Processing Unit (VPU) 623: Fifth-generation Ultra HD video processing unit for high-quality 4K video encode (up to 4K85) and decode (up to 4K135). Includes native decode support for HEVC, H.265, H.264, AV1, and VP9, as well as native encode support for HEVC, H.265, and H.264.
- Octa-core processor with four high-performance CPU cores, four efficiency CPU cores, a GPU, and a Hexagon Tensor Processor with vector and matrix extensions to manage various concurrent compute and AI workloads.
- Rich in peripherals, including integrated Ethernet with TSN, PCIe, Wi-Fi, Bluetooth, and USB.
- Built-in MCU subsystem that can replace or enhance external MCUs, offering design flexibility and reduced BOM costs.
Qualcomm - IQ-8275
CPU: 2x Kryo Gold Prime @ 2.35 GHz + 2x Kryo Gold @ 2.1 GHz + 4x Kryo Silver @ 1.95 GHz
GPU: Adreno 623 GPU
Memory: 4x16 LPDDR5/5x @ 3200 MHz
Addressable Memory: Up to 32 GB with inline ECC
Audio: DSP: V66 @ 1.3 GHz + 1x V73 @ 1.7 GHz
Up to 8x I2C/PCM/TDM
AI Performance: Scales 20–40 INT8 TOPS (Dense)
Display Support: Up to 5 displays
Typical 12 MP – 1x 4K + 2x 1920x1080
Display Interfaces: Adreno DPU 1199
1x DSI (4-lane), 1x DP1.4 (MST4)
Video Decode/Encode: 4K @ 135 Decode / 4K @ 85 Encode
Camera: 24-bit HDR safe ISP with RGB-IR CFA
Max 8 MP sensor resolution
Up to 12 cameras over 3x 4-lane CSI2
2.4 Gpix/s throughput
Peripherals: 2x PCIe Ports – 1x 2-lane + 1x 4-lane (Gen 4)
1x 2.5 GbE with TSN (SGMII)
1x QSPI
I2C/SPI/UART
USB Support: 1x USB 3.1 Gen 1, 1x USB 2.0
Storage: 1x UFS 3.1 Gen 4 2-lane, 1x 8-bit SDCC5, 1x eMMC 5.1
MCU-Like Subsystem: 4x real-time cores @ 1.85 GHz with 4x CAN FD + 1x 1 GbE (1x RGMII)
Operating System: Linux Yocto, Ubuntu
Temperature Range: -40°C to +125°C (Tj)
Build Design: FCBGA1326+HS, 25.0 mm x 25.0 mm, 0.65 mm ball pitch
CPU: 2x Kryo Gold Prime @ 2.35 GHz + 2x Kryo Gold @ 2.1 GHz + 4x Kryo Silver @ 1.95 GHz
GPU: Adreno 623 GPU
Memory: 4x16 LPDDR5/5x @ 3200 MHz
Addressable Memory: Up to 32 GB with inline ECC
Audio: DSP: V66 @ 1.3 GHz + 1x V73 @ 1.7 GHz
Up to 8x I2C/PCM/TDM
AI Performance: Scales 20–40 INT8 TOPS (Dense)
Display Support: Up to 5 displays
Typical 12 MP – 1x 4K + 2x 1920x1080
Display Interfaces: Adreno DPU 1199
1x DSI (4-lane), 1x DP1.4 (MST4)
Video Decode/Encode: 4K @ 135 Decode / 4K @ 85 Encode
Camera: 24-bit HDR safe ISP with RGB-IR CFA
Max 8 MP sensor resolution
Up to 12 cameras over 3x 4-lane CSI2
2.4 Gpix/s throughput
Peripherals: 2x PCIe Ports – 1x 2-lane + 1x 4-lane (Gen 4)
1x 2.5 GbE with TSN (SGMII)
1x QSPI
I2C/SPI/UART
USB Support: 1x USB 3.1 Gen 1, 1x USB 2.0
Storage: 1x UFS 3.1 Gen 4 2-lane, 1x 8-bit SDCC5, 1x eMMC 5.1
MCU-Like Subsystem: 4x real-time cores @ 1.85 GHz with 4x CAN FD + 1x 1 GbE (1x RGMII)
Operating System: Linux Yocto, Ubuntu
Temperature Range: -40°C to +125°C (Tj)
Build Design: FCBGA1326+HS, 25.0 mm x 25.0 mm, 0.65 mm ball pitch