Looking for a high-performance radio module for compact, connected IoT applications? The Qualcomm QCC74xM module integrates Wi-Fi 6, Bluetooth® 5.4, and IEEE 802.15.4 (Thread/Zigbee-ready) in a highly integrated tri-radio system with optional System-in-Package (SiP). At its core is a powerful 32-bit RISC-V processor with DSP, FPU, and up to 325 MHz, backed by 484 KB on-chip SRAM, 48 KB cache, 128 KB ROM, and optional up to 16 MB pSRAM and 8 MB NOR flash. Multimedia features, 35 flexible GPIOs, and rich peripheral options complete the all-in-one solution.
The QCC74xM supports hostless operation, running both protocol stacks and application logic without requiring an external MCU – perfect for power-efficient edge devices. It also operates in RCP or NCP modes for hosted designs. Built on an open FreeRTOS software platform, it includes an open-source SDK via CodeLinaro and a Visual Studio Code IDE extension for fast, adaptable development. Accelerate your IoT roadmap with a scalable platform that reduces cost and complexity.
| Category | Specifications |
|---|---|
| CPU | - 32-bit RISC-V @ 325 MHz with DSP and FPU - 128 KB ROM, 4 KB eFuse, 1/2/4 KB OTP - 484 KB on-chip SRAM (32 KB I-Cache, 16 KB D-Cache) - Optional: 4/8/16 MB pSRAM SiP - Optional: 4/8 MB NOR flash SiP |
| Bluetooth | Bluetooth 5.4 |
| Wi-Fi | 802.11b/g/n/ax |
| Security Support | - Integrated hardware crypto acceleration - Security services (secure boot, secure debug, etc.) - PSA Certified Level One |
| Interfaces & Peripherals | 32 and 46-pin LGA module pads SD/MCC/SF, SDIO, QSPI, SPI, I2C, I2S, UART, PWM, ADC/DAC, CAN, RMII, USB, VDD, GND |
| Package Type | QCC743M – 32-pin LGA module • PCB Antenna: 12.28 × 17.28 × 2.4 mm • RF Connector: 12.28 × 12.28 × 2.4 mm QCC744M – 46-pin LGA module • PCB Antenna: 14.82 × 23.63 × 2.4 mm • RF Connector: 14.82 × 18.63 × 2.4 mm Note: All modules are pin-compatible |
| Temperature Range | -40°C to +85°C |
| Voltage | Input Voltage: 2.97–3.63 V I/O Voltage: 1.8 V / 3.3 V |