5G Module -Thundercomm - TurboX™ T55
The T55 5G SOM (System On Module)integrates Qualcomm’s Snapdragon X55 5G modem-RF system offering virtually any combinations of 5G spectrum bands and modes: 5G mmWave and sub-6 GHz, standalone and non-standalone modes, TDD and FDD, spectrum sharing. The connection with AP is made through the high speed interfaces including PCIe, USB 3.1 or Ethernet . It can help OEMs to bring blazing fast connected devices to global networks in any form factors.
Applications
Features
Applications
Features
Specification | Category | Description |
SDX55 Chipset | CPU | Arm Cortex-A7 up to 1.5 GHz |
Power Management | PMX55 | |
RF Transceiver | SDR865 + SMR526 | |
Memory | DRAM/NAND | 4Gb DDR4 + 4Gb Nand |
Air Interface | 5G NR | sub-6 GHz: n1,n2,n3,n5,n7,n8,n20,n28,n41,n66,n71,n77,n78,n79 |
LTE | LTE-FDD: B1,B2,B3,B4,B5,B7,B8,B12,B13,B14,B17,B18,B19,B20, B25,B26,B27,B28,B29, B30,B32,B66,B71 LTE-TDD: B34,B38,B39,B40,B41,B42,B43,B48 | |
WCDMA | B1/B2/B3/B4/B5/B8/B9/B19 | |
CDMA | BC0,BC1,BC10 | |
GNSS | GPS/Beidou/GLONASS/Galileo | |
Data Rate | Peak Download Speed | 5G NR: 7 Gbps , DL 4×4 MIMO |
Peak Upload Speed | 5G NR: 3 Gbps | |
Connectivity and Peripheral Interface | BLSP | 4x BLSP supports UART, SPI, and I2C |
UIM | 2 x UIM | |
PCI express | 2 x Gen 3 | |
I2S | 2 x I2S/PCM | |
USB | 1 x USB 3.1 | |
Form Factor | T55-L | LGA Package: 42.5*42*2.6mm |
T55-M | M.2 Package: Ongoing | |
Power | Voltage Range | 3.8 V to 4.2V |
Temperature Range | Operation | -40°C to + 85°C |
Storage | -40°C to + 85°C | |
Software | Operating System | Linux |