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Thundercomm

TurboX C8750 System on Module

HAN: TurboX C8750 System on Module SKU: ATE104688
  • Next-gen compute: Oryon™ CPU (up to 1.5× vs. previous gen)
  • Edge-AI power: 8th-gen AI engine (up to 10× vs. previous gen)
  • Graphics & video: ~3× GPU uplift; 4K240/8K60 decode, 4K120/8K30 encode, AV1 decoder
  • Imaging: triple ISP, up to 3 × 48 MP @ 30 FPS; HW sHDR, ASE
  • Virtualization: hypervisor with trusted VMs (TVMs)
  • Displays: on-device 4K@60 & QHD+@240; external 8K@30 & 1080p@240
  • Industrial-ready: −35…+75 °C, LGA 39×33×2.75 mm


 
Price on request
  • Lead time on request
FAE support included (B2B-Projects) Invoice, PayPal & prepayment

Product description

TurboX C8750 SOM – System on Module (Qualcomm® CQ8750S)

The TurboX C8750 SOM is a highly integrated system on module powered by Qualcomm® CQ8750S built on a 3 nm process, supporting Android and Linux*. It combines Oryon™ CPU cores, an 8th-gen AI engine and advanced graphics/video—ideal for IoT products requiring high compute, imaging and rendering performance. *EVT samples use SM8750P.
 

Key Features & Benefits

  • Next-gen compute: Oryon™ CPU (up to 1.5× vs. previous gen)
  • Edge-AI power: 8th-gen AI engine (up to 10× vs. previous gen)
  • Graphics & video: ~3× GPU uplift; 4K240/8K60 decode, 4K120/8K30 encode, AV1 decoder
  • Imaging: triple ISP, up to 3 × 48 MP @ 30 FPS; HW sHDR, ASE
  • Virtualization: hypervisor with trusted VMs (TVMs)
  • Displays: on-device 4K@60 & QHD+@240; external 8K@30 & 1080p@240
  • Industrial-ready: −35…+75 °C, LGA 39×33×2.75 mm

Performance deltas vs. prior gen per vendor information.
 

Use Cases

  • Smart cameras & video conferencing
  • Automated manufacturing robots, AMRs & cobots
  • Delivery robots & edge computing
  • Urban air mobility (UAM) transportation

Based on manufacturer’s application list.
 

Technical Specifications (excerpt)

Platform Qualcomm® CQ8750S; EVT: SM8750P
CPU Oryon™ (8-core), Prime up to 4.32 GHz; Performance up to 3.53 GHz
GPU Adreno™ 830
Memory 16 GB LPDDR5x + 128 GB UFS 3.1
AI INT4/8/16 & FP16; mixed precision (INT8+INT16)
Display On-device: 4K@60, QHD+@240; External: 8K@30, 1080p@240
Camera 3 × 48 MP@30; 4 × CSI D-PHY (4-lane), 2 × CSI C-PHY (3-trio)
Video Decode 4K240/8K60; Encode 4K120/8K30; AV1 decoder
PCIe 1 × PCIe Gen3 (2-lane)
USB 1 × USB 3.1 Gen2 with DP 1.4
Connectivity No built-in Wi-Fi
Operating Temp −35 °C to +75 °C
Voltage 3.2 V to 4.5 V
Form Factor LGA; 39 × 33 × 2.75 mm (excl. bottom shield height)
OS Android 15, Linux*
Compliance RoHS*/REACH*/WEEE*/TSCA* (*planning)

Specifications per vendor; subject to change.
 

FAQ

Does the module support Linux?

Yes—Linux support is listed (*planning*); Android 15 is stated. :contentReference[oaicite:13]{index=13}

Is Wi-Fi integrated?

No—the module is specified as having no built-in Wi-Fi.

What operating temperature is supported?

The operating range is −35 °C to +75 °C. :contentReference[oaicite:14]{index=14}

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