XPC10010MB-01 – xPico IAP Module, Modbus
xPico IAP is an extremely compact networking solution that enables Ethernet connectivity on virtually any device with a serial interface. The included industry-proven Lantronix device server application with full IP stack and Modbus Protocol support allows seamless remote access to device data, simplifying design integration while providing robust connectivity. As the smallest embedded device server in the world, xPico IAP can be utilized in designs typically intended for chip solutions. A key difference with the xPico IAP is that there is virtually no need to write a single line of code, translating to a much lower development cost and faster time-to-market.
xPico IAP Highlights:
• Chip-sized Footprint: 24mm x 16.5mm
• Complete Device Server Application with Full IP Stack
• Modbus TCP, ASCII, RTU Support
• Serial Port Supporting Up to 115.2kbps
• Extended Temperature: -40° to +85° C
Features and Specifications
> Serial Interface
• Two Serial CMOS Ports* (3.3V, 5V tolerant)
• 300 to 115.2 kbps for Modbus enabled serial port
• Control signals: DTR/DCD, RTS/CTS (Port 1 only)
• Flow control XON/XOFF
• Programmable I/O: 8 PIO pins (software selectable)
• Lantronix Modbus Application
• Modbus TCP, Modbus ASCII, Modbus RTU. Master and Slave mode support * Modbus can only be operated on one serial port at a time.
> Network Interface
• Interface: Ethernet 10Base-T or 100Base-TX (Autosensing)
Network Protocols
• TCP/IP, UDP/IP, DHCP, ARP, ICMP, DHCP, Auto-IP, DNS, SNMPv1, TFTP, Modbus TCP, ASCII, RTU
> Management and Control
• SNMP, Telnet, Serial
• Field upgradable firmware
> Architecture
• Based on the DSTni-EX Enhanced 16-bit x86 Architecture
• Memory: 256KB SRAM, 512KB Flash
> Available Software
• MS Windows based DeviceInstaller™
• MS Windows based Com Port Redirector > Power
• Input Voltage: 3.3VDC > Physical Interface
• 40-pin Board-to-Board SMT Connector
> Environmental
• Operating Temperature: –40° to +85° C
• Storage Temperature : –40° to +85° C
• Relative Humidity: 0% to 90% non-condensing
> Packaging
• Dimensions: 24mm (L) x 16.5mm (W) x 5.64mm (H) • Weight: 2.5g
> Warranty
• 5-Year Limited
xPico IAP Highlights:
• Chip-sized Footprint: 24mm x 16.5mm
• Complete Device Server Application with Full IP Stack
• Modbus TCP, ASCII, RTU Support
• Serial Port Supporting Up to 115.2kbps
• Extended Temperature: -40° to +85° C
Features and Specifications
> Serial Interface
• Two Serial CMOS Ports* (3.3V, 5V tolerant)
• 300 to 115.2 kbps for Modbus enabled serial port
• Control signals: DTR/DCD, RTS/CTS (Port 1 only)
• Flow control XON/XOFF
• Programmable I/O: 8 PIO pins (software selectable)
• Lantronix Modbus Application
• Modbus TCP, Modbus ASCII, Modbus RTU. Master and Slave mode support * Modbus can only be operated on one serial port at a time.
> Network Interface
• Interface: Ethernet 10Base-T or 100Base-TX (Autosensing)
Network Protocols
• TCP/IP, UDP/IP, DHCP, ARP, ICMP, DHCP, Auto-IP, DNS, SNMPv1, TFTP, Modbus TCP, ASCII, RTU
> Management and Control
• SNMP, Telnet, Serial
• Field upgradable firmware
> Architecture
• Based on the DSTni-EX Enhanced 16-bit x86 Architecture
• Memory: 256KB SRAM, 512KB Flash
> Available Software
• MS Windows based DeviceInstaller™
• MS Windows based Com Port Redirector > Power
• Input Voltage: 3.3VDC > Physical Interface
• 40-pin Board-to-Board SMT Connector
> Environmental
• Operating Temperature: –40° to +85° C
• Storage Temperature : –40° to +85° C
• Relative Humidity: 0% to 90% non-condensing
> Packaging
• Dimensions: 24mm (L) x 16.5mm (W) x 5.64mm (H) • Weight: 2.5g
> Warranty
• 5-Year Limited