Search for: Robotics

• Based on the Qualcomm® QRB5165 System-on-Chip
• 5th generation AI engine
• Ubuntu 18.04 Linux

• based on the Qualcomm® SXR2130P SoC
• 15 trillion operations per second
• Wi-Fi 6 connectivity

• Drone Reference Platform (DRP) to accelerate development, validation, testing, and prototyping of UAV designs
• Based on Lantronix Open-Q™ 8550CS µSOM with Qualcomm® Dragonwing™ QCS8550
• Flight-ready with Pixhawk 6X flight controller and PX4 support
• Advanced AI vision with FLIR Hadron 640R thermal camera + on-device AI for detection/tracking
• SWaP-optimized (size, weight & power) for UAV applications
• Linux Yocto and Qualcomm Hexagon™ Tensor Processor (HTP) for on-device AI
• Multiple MIPI cameras and multiple wireless connectivity options

• Qualcomm Kryo™ Gen 6 Octa-Core + Adreno™ 663 GPU
• 36 GB LPDDR5 ECC RAM for industrial robustness
• Up to 100 INT8 TOPs via Qualcomm AI Engine™
• Supports LLMs like LLaMA 27B at 22 tokens/sec
• 16 concurrent video streams (ISP)
• Real-time subsystem for safety-critical tasks
• Operating range: –40 °C to +90 °C
• TAA-compliant for public sector use

• 18 GB LPDDR5 ECC RAM (TAA-compliant)
• Qualcomm Kryo™ Gen 6 Octa-Core CPU + Adreno™ 663 GPU
• Up to 100 INT8 TOPs with Qualcomm AI Engine™
• Supports LLMs like LLaMA 27B (22 tokens/sec)
• Processes up to 16 camera streams simultaneously
• Real-time subsystem & safety architecture
• Extended temperature: –40 °C to +90 °C

• Qualcomm Dragonwing™ QCS6490 platform
• Up to 12 Dense TOPS edge AI performance
• Global 5G + Wi-Fi 6E connectivity
• 8GB RAM, 64GB UFS storage
• PoE++ Ethernet & industrial interfaces
• Designed for vision & physical AI workloads

• Qualcomm Dragonwing™ IQ615 platform
• Up to 3 Dense TOPS AI performance
• Global 5G cellular modem
• Wi-Fi 6E (2.4/5/6 GHz)
• 4GB RAM, 64GB UFS storage
• Industrial PoE++ and I/O interfaces

• LGA sample variant for evaluation, design-in and early integration phases
• Compact LGA form factor with 18 × 28.5 × 3.15 mm dimensions
• Hostless microprocessor architecture simplifies integration without an external host MCU
• Dual-band Wi-Fi 6 / 802.11ax with 2.4 GHz and 5 GHz support
• Bluetooth Low Energy 5.4 with central and peripheral roles
• Fast Ethernet with integrated 10/100BASE-T Ethernet PHY
• Dual U.FL antenna for Wi-Fi and BLE functions
• Enterprise Wi-Fi security with EAP / 802.1X
• Concurrent Soft AP + client mode for direct service access without disrupting field operations
• Can operate as a network co-processor or wireless MCU
• Interfaces according to part-number description: Fast Ethernet, serial, USB, I2C, SPI, SDIO, GPIO
• Pre-integrated with Lantronix Percepxion™ cloud-based IoT edge solution
• Industrial-grade operating temperature range from -40 °C to +85 °C

• LGA tape-and-reel variant for serial production, manufacturing planning and bulk sourcing
• Packaging unit: 500 pieces according to the official part-number description
• Compact LGA form factor with 18 × 28.5 × 3.15 mm dimensions
• Hostless microprocessor architecture simplifies integration without an external host MCU
• Dual-band Wi-Fi 6 / 802.11ax with 2.4 GHz and 5 GHz support
• Bluetooth Low Energy 5.4 with central and peripheral roles
• Fast Ethernet with integrated 10/100BASE-T Ethernet PHY
• Dual U.FL antenna for Wi-Fi and BLE functions
• Enterprise Wi-Fi security with EAP / 802.1X
• Concurrent Soft AP + client mode for direct service access without disrupting field operations
• Can operate as a network co-processor or wireless MCU
• Interfaces according to part-number description: Fast Ethernet, serial, USB, I2C, SPI, SDIO, GPIO
• Pre-integrated with Lantronix Percepxion™ cloud-based IoT edge solution
• Industrial-grade operating temperature range from -40 °C to +85 °C

MPN: XPC600300SManufacturer: Lantronix

• Tray packaging for production, serial deployment and bulk sourcing
• Packaging unit: 200 pieces according to the provided product information
• Hostless microprocessor architecture simplifies integration without an external host MCU
• Dual-band Wi-Fi 6 / 802.11ax with 2.4 GHz and 5 GHz support
• Bluetooth Low Energy 5.4 with central and peripheral roles
• Fast Ethernet with integrated 10/100BASE-T Ethernet PHY
• Dual U.FL antenna for Wi-Fi and BLE functions
• Enterprise Wi-Fi security with EAP / 802.1X
• Concurrent Soft AP + client mode for direct service access without disrupting field operations
• Can operate as a network co-processor or wireless MCU
• Interfaces according to part-number description: Fast Ethernet, serial, USB, I2C, SPI, SDIO, GPIO
• Pre-integrated with Lantronix Percepxion™ cloud-based IoT edge solution
• Industrial-grade operating temperature range from -40 °C to +85 °C

• Hostless microprocessor architecture simplifies integration without an external host MCU
• Dual-band Wi-Fi 6 / 802.11ax with 2.4 GHz and 5 GHz support
• Bluetooth Low Energy 5.4 with central and peripheral roles
• Fast Ethernet with integrated 10/100BASE-T Ethernet PHY
• Dual U.FL antenna for Wi-Fi and BLE functions
• Enterprise Wi-Fi security with EAP / 802.1X
• Concurrent Soft AP + client mode for direct service access without disrupting field operations
• Can operate as a network co-processor or wireless MCU
• Interfaces according to part-number description: Fast Ethernet, serial, USB, I2C, SPI, SDIO, GPIO
• Pre-integrated with Lantronix Percepxion™ cloud-based IoT edge solution
• Industrial-grade operating temperature range from -40 °C to +85 °C

• Qualcomm Dragonwing™ IQ615 platform
• Up to 3 Dense TOPS AI performance
• Global 4G LTE + Wi-Fi 6E
• 4GB RAM, 64GB UFS storage
• PoE++ Ethernet & industrial I/O
• Designed for vision and automation workloads

MPN: XPC600100EKManufacturer: Lantronix

• Hostless microprocessor architecture simplifies integration without an external host MCU
• Dual-band Wi-Fi 6 / 802.11ax with 2.4 GHz and 5 GHz support
• Ethernet connectivity with integrated 10/100BASE-T Ethernet PHY
• Bluetooth Low Energy 5.4 for industrial IoT and embedded applications
• Enterprise Wi-Fi security with EAP / 802.1X
• Concurrent Soft AP + client mode for direct service access without disrupting field operations
• Can operate as a network co-processor or wireless MCU
• Pre-integrated with Lantronix Percepxion™ cloud-based IoT edge solution
• Supports secure device updates and CRA-oriented lifecycle management
• Industrial-grade operating temperature range from -40 °C to +85 °C
• Approvals / compliance for USA, Canada, EU, Japan, Taiwan, China and India