Surveillance, Drones & C2 Systems

• Modular drone command & control platform
• Up to 20 km control range
• < 50 ms ultra-low latency
• 6.95” FHD 1000 cd/m² touchscreen
• Open Android platform with OTA support
• Available as turnkey, SKD or CKD

Manufacturer: MeerecompanyMPN: i200DK

Time of Flight 3D Depth Camera i200DK from Meerecompany:

• Need accurate 3D vision, even in bright sunlight?
• The Meerecompany i200DK Time of Flight camera delivers. 
• With a long 7-meter range and crisp VGA resolution, it captures detailed depth for superior object recognition and measurement.
• Its sunlight-robust design ensures stable and reliable results in any lighting. 
• Ideal for demanding outdoor applications like robot navigation and drone obstacle avoidance. 

• Advanced AI: Accurate measurements, defect detection, object recognition.
• Powerful Processing: Fast image analysis and processing.
• Flexible Integration: Seamlessly connect to existing systems.
• Durable Design: Built for harsh environments.
• User-Friendly: Easy to set up and operate.

• Improved Efficiency: Faster inspections, reduced costs.
• Enhanced Quality: Consistent, accurate quality control.
• Increased Productivity: Faster production cycles.
• Cost Savings: Optimized resource allocation.
• Enhanced Traceability: Track product information.
• Let's discuss how our technology can benefit your business.

• Based on the Qualcomm® QRB5165 System-on-Chip
• 5th generation AI engine
• Ubuntu 18.04 Linux

• significant communications and video capture and processing capabilities
• integrated WiFi 6 & BLE 5.1 in chipset
• powerful CPU and GPU engines
• neural, computer vision and DSPs
• many I/O interfaces to external systems to provide intelligent feedback.

• Open-Q 615IQ SOM SMARC 8GB LPDDR4, 64GB UFS, Wi-Fi/BT

• Drone Reference Platform (DRP) to accelerate development, validation, testing, and prototyping of UAV designs
• Based on Lantronix Open-Q™ 8550CS µSOM with Qualcomm® Dragonwing™ QCS8550
• Flight-ready with Pixhawk 6X flight controller and PX4 support
• Advanced AI vision with FLIR Hadron 640R thermal camera + on-device AI for detection/tracking
• SWaP-optimized (size, weight & power) for UAV applications
• Linux Yocto and Qualcomm Hexagon™ Tensor Processor (HTP) for on-device AI
• Multiple MIPI cameras and multiple wireless connectivity options

• 2 serial console ports (RJ45)
• 1x Gigabit Ethernet, 1x USB-C
• Out-of-band access for small networks
• Integrated security: SSH, HTTPS, VPN
• Perfect for edge and remote infrastructure

• Open-Q 8550CS SOM Dev Kit
• HDMI & Camera Adapter Board
• WiFi & BT Antennas, Power Supply

• 18 GB LPDDR5 ECC RAM (TAA-compliant)
• Qualcomm Kryo™ Gen 6 Octa-Core CPU + Adreno™ 663 GPU
• Up to 100 INT8 TOPs with Qualcomm AI Engine™
• Supports LLMs like LLaMA 27B (22 tokens/sec)
• Processes up to 16 camera streams simultaneously
• Real-time subsystem & safety architecture
• Extended temperature: –40 °C to +90 °C

• Unmanaged PoE++ injector with up to 90 W output
• Multi-Gigabit data rates: 10M to 10G
• Supports IEEE 802.3af/at/bt PoE standards
• Compact IP31 housing for DIN rail
• Wide operating temperature: –40 °C to +75 °C
• Ideal for cameras, access points, traffic systems

• Qualcomm Dragonwing™ QCS6490 platform
• Up to 12 Dense TOPS edge AI performance
• Global 5G + Wi-Fi 6E connectivity
• 8GB RAM, 64GB UFS storage
• PoE++ Ethernet & industrial interfaces
• Designed for vision & physical AI workloads

• Qualcomm Dragonwing™ IQ615 platform
• Up to 3 Dense TOPS AI performance
• Global 5G cellular modem
• Wi-Fi 6E (2.4/5/6 GHz)
• 4GB RAM, 64GB UFS storage
• Industrial PoE++ and I/O interfaces

• Qualcomm Dragonwing™ IQ615 platform
• Up to 3 Dense TOPS AI performance
• Global 4G LTE + Wi-Fi 6E
• 4GB RAM, 64GB UFS storage
• PoE++ Ethernet & industrial I/O
• Designed for vision and automation workloads

• The S.CUBE Time of Flight Sensor (ToF) module provides high-speed, real-time 3D depth raw data.
• The S.CUBE module is a 3D ToF development kit with VCSEL IR illumination.
• S.CUBE is a module of compact size with ASIC and MIPI interface on board (Optional: USB 3.0) - Important: The development kit is delivered with a USB interface!
• Thanks to its compact board design it is designed for easy system integration.

• Ultra compact Multi-GNSS engine LS550G

• Dual 14-bit Qualcomm Spectra™ 250L ISP capable of supporting up to 24MP at 30fps
• Qualcomm® Adreno™ 612 GPU with 64-bit addressing @ up to 845MHz with latest API support
• ​Qualcomm® Hexagon™ DSP with dual hexagon vector extensions for running DNN models and advanced Qualcomm® Neural Processing Engine SDK support
• Octa-core Qualcomm® Kryo™ 460 CPU optimized for power and DMIPS
• Qualcomm AI Engine designed to support accelerated on-device machine learning