Industrial Vision & Edge AI
Industrial vision moves quality inspection, object recognition and process monitoring directly onto the machine. The key is combining high-performance camera and image sensors with edge-AI compute that runs neural networks locally and in real time – for low latency and data sovereignty in production. Atlantik Elektronik supplies the compute platform, image capture and connectivity as a coordinated package: edge compute, camera modules, microprocessors and industrial switches.
Back to overview: Industrial Solutions.
Industrial AI Camera Solution
- Advanced AI: Accurate measurements, defect detection, object recognition.
- Powerful Processing: Fast image analysis and processing.
- Flexible Integration: Seamlessly connect to existing systems.
- Durable Design: Built for harsh environments.
- User-Friendly: Easy to set up and operate.
Benefits:
- Improved Efficiency: Faster inspections, reduced costs.
- Enhanced Quality: Consistent, accurate quality control.
- Increased Productivity: Faster production cycles.
- Cost Savings: Optimized resource allocation.
- Enhanced Traceability: Track product information.
- Let's discuss how our technology can benefit your business.
Lantronix - Open-Q 615IQ Development Kit - LOQ-615IQ-EVK
- Open-Q 615IQ Development Kit
meerecompany – S.CUBE High Res ToF 3D Depth Camera (ASIC MP type)
- The S.CUBE Time of Flight Sensor (ToF) module provides high-speed, real-time 3D depth raw data.
- The S.CUBE module is a 3D ToF development kit with VCSEL IR illumination.
- S.CUBE is a module of compact size with ASIC and MIPI interface on board (Optional: USB 3.0) - Important: The development kit is delivered with a USB interface!
- Thanks to its compact board design it is designed for easy system integration.
ProLabs - SFP-10G-SR-C, 10GBASE-SR SFP+, 850nm, 300m, Cisco SFP-10G-SR comp.
Qualcomm Dragonwing™ IQ-9075 EVK - Industrial Edge AI Platform
- Evaluation kit based on Qualcomm Dragonwing™ IQ-9075
- Designed for edge AI and embedded vision workloads
- Supports advanced AI and LLM inference at the edge
- Rich camera, sensor and industrial I/O interfaces
- Ideal for prototyping and series-ready validation
Qualcomm Snapdragon - QCS2290
Qualcomm Snapdragon - QCS2290 - The application processor that delivers flexible connectivity, enhanced GPS and advanced camera features.
Quectel - QCT-RM520NGLAA-M20-SGASA / 5G Sub-6 GHz M.2 Module
- RM520N cellular 5G/LTE-cat19 M.2 module
Rubik Pi 3 - Edge AI Platform
Manufacturer: ThundercommMPN: Rubik Pi 3
The RUBIK Pi 3 is a lightweight development board based on the Qualcomm® QCS6490 platform. It is the first Pi built on Qualcomm AI platforms for developers.
The RUBIK Pi 3 is compatible with a range of operating systems, including Android, Linux and LU, and is equipped with SDKs from Thundercomm to enhance the developer experience. The Qualcomm® QCS6490 offers excellent AI performance at 12.5 TOPS, and can be paired with the Qualcomm AI Hub to enable developers to experience first-hand the impact of AI evolution.
Teltonika Networks – RUTX50 5G Dual SIM Router EMEA, Oceania, Brazil
The Teltonika RUTX50 is a powerful 5G industrial router (SA/NSA) delivering up to 3.3 Gbps downlink and 900 Mbps uplink. It features Dual-Band Wi-Fi 5 (up to 867 Mbps), 1× WAN + 4× LAN Gigabit Ethernet, GNSS, and a full VPN suite (WireGuard, IPsec, OpenVPN). With its IP30 aluminium housing, −40 °C to +75 °C temperature range, and 9–50 V DC input, it is ideal for industrial connectivity, SD-WAN, and remote access.
Thundercomm - TurboX - EB5G2 Edge AI Station
- Premium performance with high AI computing power and multiple channel decoding
- Rich interfaces, multiple type of network for Edge computing scenarios
- Industrial design for harsh conditions
- Deeply optimized streaming media AI analysis service
- Visual configuration of AI algorithms and applications
- Edge cloud collaboration, large-scale deployment, one-stop management
Thundercomm - TurboX C8550 Development Kit
Thundercomm TurboX I615 SOM
- High-performance System-on-Module for embedded and edge AI
- Designed for industrial and scalable production designs
- Supports AI workloads, embedded vision and IoT applications
- Compact SOM format for fast integration
- Long-term availability and professional software support
Matching products & platforms at ATE
- Single Board Computers & SOM: edge-AI compute core with NPU for local inference at the line
- Camera Modules for SBC/SOM: MIPI-CSI and USB cameras for direct board connection
- Camera Modules & Image Sensors: image sensing for inspection and object recognition
- Microprocessors (MPUs): application processors with AI acceleration for vision systems
- Switches: industrial Ethernet for GigE Vision and deterministic data paths
- Qualcomm Technologies: platforms with a dedicated AI compute unit for vision workloads
From component selection to series production – with one partner
From camera selection to model deployment, our FAEs support the design of compute, optical connection and data path. Request your project now.
Frequently asked questions
Why vision at the edge instead of the cloud?
Inline inspection at production speed requires short, constant latencies. Local processing also ensures data sovereignty and operation without a permanent cloud connection.
Which camera interface suits my board?
MIPI-CSI cameras suit compact integration, while USB or GigE Vision cameras suit flexible distances and higher resolutions. The right choice depends on platform and application – our FAEs advise.
How much AI compute do I need?
It depends on model size, resolution and required frame rate. We help classify the right NPU or compute tier for your model so the platform is neither over- nor under-dimensioned.
Is there support for BSP and AI frameworks?
Yes – through development services we support BSP adaptation, driver integration and commissioning of common inference frameworks on the target platform.
Not found the right product?
Our portfolio is larger than the web shop. Tell us your requirement – we will find the right platform, across all manufacturers.
