Skip to main content Skip to search Skip to navigation
Authorized Distributor DIN EN ISO 9001:2015 NDAA- & TAA-compliant products SSL-encrypted ordering Payment methods Invoice PayPal Prepayment Bank transfer
Qualcomm

Qualcomm QCC744 Chip, TR Reel

HAN: QCC-744-2-MQFN56-TR-00-0 SKU: ATE104536
Tri-radio SoC with Wi-Fi 6, Bluetooth 5.4 & 802.15.4. RISC-V core, rich I/O, secure & multimedia-ready. Built for advanced IoT devices.
2,85 €
excl. 19% VAT , plus shipping costs
  • Lead time on request
FAE support included (B2B-Projects) Invoice, PayPal & prepayment

Product description

Developing advanced IoT devices and looking for a compact, high-performance system solution? The Qualcomm QCC74x combines Wi-Fi 6, Bluetooth 5.4, and IEEE 802.15.4 (Thread/Zigbee-ready) into a single, highly integrated chip. Powered by a 32-bit RISC-V processor up to 325 MHz with DSP and FPU, 484 KB SRAM, 48 KB cache, and an optional SiP featuring up to 16 MB pSRAM and 8 MB NOR flash, it’s built for energy-efficient edge applications. With 35+ flexible GPIOs and integrated multimedia support, QCC74x is ideal for demanding connected product solutions.

Its hostless FreeRTOS-based operation, open-source SDK (via CodeLinaro), and dedicated VS Code IDE extension enable rapid, scalable development without the need for an external MCU. Alternatively, it can operate as a connectivity transceiver in RCP or NCP configurations. Reduce time-to-market, system complexity, and overall cost – with one future-ready platform for your next-generation IoT product.



Specifications

Category Details
CPU Name: RISC-V1
Clock Speed: 325 MHz
Wi-Fi Antenna Configuration: 1x1
Standards: 802.11b/g/n/ax
Spectral Bands: 2.4 GHz
Bluetooth Specification Version: Bluetooth® 5.32
Security Features: Secure Boot, Cryptographic Accelerator, Qualcomm® Trusted Execution Environment & Services, Secure Debug
Package Type: QFN3
Pitch: 0.4 mm
SRAM Density: 484 kB
Interfaces Supported Interfaces: PWM, I²C, up to 35x GPIO, RMII, DAC, SPI, SDIO, UART, I²S, ADC, QSPI, CAN

Technical question? Talk to our FAEs.

Our Field Application Engineers support you with platform selection, integration and the path to series production – across manufacturers.

Matching accessories & bundles