Product description
FME164Q is a high-performance Wi-Fi 6 and Bluetooth 5.3 module, based on Qualcomm QCC2064, launched by Quectel, which can be used for WLAN and Bluetooth connections. With its compact size of 22.0 mm × 30.0 mm × 4.0 mm, the module fits into the M.2 2230 KEY-E package and is easy to integrate into the host device. It can also effectively lower production costs, increase production efficiency, and fulfill the demands of complicated environments.
With support for multi-link operation (MLO), FME164Q enables several links between Wi-Fi 6 devices to be transmitted and received over a single channel, with each channel supporting up to 1024 QAM. ME164Q operates simultaneously on 2.4 GHz and 5 GHz, and supports 2 × 2 + 2 × 2 MIMO and DBS (Dual Band Simultaneous), delivering a maximum physical layer data transmission rate of 1774.5 Mbps.
Based on a reliable PCIe 3.0 interface, FME164Q achieves low-power and high-speed data transmission. Coupled with its higher power consistency and accuracy and ultra-wide temperature range, the module can meet the requirements of industries, consumer goods and laptop applications.
Specifications
- Wi-Fi 6 module M.2
- Dual Band 2,4/5GHz Simultaneous
- Max. data rate of 1774.5 Mbps
- M.2 2230 KEY-E package
- 22 mm × 30 mm × 4.0 mm
- 3.22 g
- Operating temperature range of -30°C to +65°C
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