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Qualcomm

Qualcomm - DK-QCC5121-WLCSP81-A-0 - Development Kit

HAN: DK-QCC5121-WLCSP81-A-0 SKU: ATE102072 Internal no.: 33224
Development Kit for the Qualcomm QCC5121 Bluetooth Audio SoC
680,00 €
excl. 19% VAT , Free shipping
  • Lead time on request
FAE support included (B2B-Projects) Invoice, PayPal & prepayment

Product description

Development Kit DK-QCC5121-WLCSP81-A-0 for the Qualcomm QCC5121 Bluetooth Audio SoC

Low Power Bluetooth Audio SoC, designed for use in compact, feature rich wire-free earbuds, hearables and headsets

  • CDA Development Board Rev 2 (board) with the following parts prefitted by Qualcomm:
    • 3.7 V, 3Ah Battery
    • QCC5121-81WLCSP-AA WLCSP81 module
    • Micro coax cable
  • 2400-2484 MHz Antenna
  • 1 m long USB cable with USB-C plug
  • USB Charger 5 V 2 A
  • Set of 40 colored patch leads for general-purpose use


Specifications

Bluetooth

Bluetooth Version

  • Bluetooth 5.0

Bluetooth Technology

  • Bluetooth Low Energy
  • Bluetooth Low Energy sensor hub
  • Dual-mode Bluetooth

Bluetooth Speed

  • 2 Mbps
Voice Services

Digital Assistant Activation

  • Button press
  • Qualcomm® Voice Activation
General Audio

Audio Technology

  • Qualcomm® Broadcast Audio technology
  • Qualcomm TrueWireless™ Stereo technology
  • Qualcomm TrueWireless™ Stereo Plus technology
  • Qualcomm® Active Noise Cancellation (ANC) technology
  • Qualcomm® aptX™ audio technology
  • Qualcomm® cVc™ audio technology

Qualcomm® aptX™ playback support

  • aptX Classic
  • aptX HD
  • Qualcomm® eXtension program

Audio Playback Support

  • Stereo playback

Qualcomm® Active Noise Cancelling (ANC) technology

  • Feedforward
  • Feedback
  • Hybrid

Qualcomm® cVc™ audio technology

  • 2-mic Headset
CPU

CPU Clock Speed

  • Up to 80 MHz

CPU Features

  • Programmable Apps CPU

CPU Bit Architecture

  • 32-bit
DSP

DSP RAM

  • 80kB (P) + 256kB (D)

DSP Technology

  • 2x Qualcomm® Kalimba™ DSP
  • Configurable DSP

DSP Clock Speed

  • 2x 120 MHz DSP
Power Consumption

Amperage

  • ~6mA, A2DP stream (SBC), measured at battery terminal, 3.7v including load
  • ~7mA HFP Narrow Band, 1 Digital MIC cVc
Package

Package Type

  • WLCSP

Pins

  • 81 pins (9 x 9)

Pitch

  • 0.4mm

Package Size

  • 3.98 x 4.02 x 0.5 mm

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