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Qualcomm

Qualcomm QCC730 Module - PCB Antenna - xPA

HAN: QCC-730M-1-LGM42A-MT-00-0-AB SKU: ATE104547 Internal no.: 45423
Manufactuer: Qualcomm
Dual-band Wi-Fi 4 module with RF connector. Ultra-low power & cloud-ready – ideal for smart sensors, wearables, and external-antenna IoT designs.
6,34 €
excl. 19% VAT , plus shipping costs
From Unit price / pcs Savings
1+ 6,34 € –
1+ 3,66 €* 42 %
101+ 3,48 €* 45 %
2001+ 3,43 €* 46 %
Project pricing on request – response within 24 h
  • Lead time on request
FAE support included (B2B-Projects) Invoice, PayPal & prepayment

Product description

The Qualcomm® QCC730M is a high-performance 1x1 dual-band Wi-Fi 4 module designed for ultra-low-power IoT applications. Its selectable power modes and advanced power management deliver exponentially extended battery life—ideal for battery-powered or energy-harvested smart devices. With full stack offloading, it enables direct cloud connectivity while freeing host processor resources for dedicated application logic.

Driven by an open-source SDK on CodeLinaro and supported by the Qualcomm® Connectivity IDE based on VS Code, QCC730M offers maximum flexibility for custom IoT development. Pre-certified, cost- and size-optimized modules and evaluation kits are also available to reduce complexity and speed up time to market. Unlock efficient, scalable IoT innovation with a module built for power-conscious, connected designs.



Specifications

Category Parameter Details
Wi-Fi Standards 802.11b, 802.11g, 802.11n, 802.11a
  Spectral Bands 2.4 GHz, 5 GHz
  Channels 20 MHz
  Antenna Configuration 1x1
  Features up to MCS3
Security Features Secure Boot, Cryptographic Accelerator, Qualcomm® Trusted Execution Environment & Services, Secure Debug
RAM Density 1.5 MB
SRAM Density 640 kB
Interfaces Supported Interfaces Master I²C, 15x muxed GPIO, Slave SPI, 2-wire UART, Master QSPI
Package Type LGA
  Pitch 1.27 mm

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