Product description
The SE89-DISS-3-PK is an active heat sink from Seco, factory-packaged, for the SBC-E89-pITX Pico-ITX SBC series.
SE89-DISS-3-PK Overview
Configuration & Features
- Product line per official Seco distributor list: DIS (dissipation/accessory)
- Associated product family: E89
- Design: active heat sink, factory-packaged
- The associated board SBC-pITX-ADL-N/ASL/TWL is a Pico ITX single board computer based on Intel® Atom® processors x7000E Series, Intel® Core™ i3 processor, and Intel® Processors N Series (codename Alder Lake N, Amston Lake and Twin Lake), designed for compact industrial edge systems
- The board integrates LPDDR5-5200 soldered memory up to 16 GB with IBECC support and supports up to two independent displays via LVDS or eDP plus HDMI, up to two 2.5 GbE ports, and M.2 expansion for WiFi/Bluetooth (Key E) and WWAN (Key B)
Typical Applications
The heat sink is intended for use with the SBC-pITX-ADL-N/ASL/TWL Pico-ITX SBC in compact industrial edge systems, for example in the Embedded Computing category.
Note for Procurement
No publicly available details on stock levels, lead times or project pricing for the SE89-DISS-3-PK are currently published; this information is available on request. Contact the ATE team for availability and project pricing.
Downloads & documentation
Technical question? Talk to our FAEs.
Our Field Application Engineers support you with platform selection, integration and the path to series production – across manufacturers.
