Product description
The SM-E88 heat sink from Seco (manufacturer part number RE88-DISS-2-PK) is a passive heat sink for the SOM-SMARC-MX95 SMARC computer-on-module, in a no-lid version and factory packaged.
SM-E88 Heat Sink Overview
According to the manufacturer, the heat sink belongs to product line DIS and is assigned to module family E88. For ordering purposes, the SOM-SMARC-MX95 is referred to by its base code, "E88".
Configuration & Features
- Manufacturer part number: RE88-DISS-2-PK
- Product line per manufacturer: DIS
- Associated module family: E88 (SOM-SMARC-MX95)
- Version: passive, no lid
- Supply form: factory packaged
Typical Application Areas
The heat sink is intended for the SOM-SMARC-MX95, a SMARC® computer-on-module with NXP i.MX 95 applications processors. SOM-SMARC-MX95 In stock SMARC® Rel. 2.1.1 Computer on Module with NXP i.MX 95 Applications Processors, delivering optimized processing and advanced Machine Learning acceleration for next-generation edge computing applications. Modules of this type are used, among other areas, in industrial vision and Edge AI as well as in power supplies & enclosures for embedded computing projects.
Note for Procurement
The associated SOM-SMARC-MX95 (E88) module is currently in pre-series phase according to Seco. This product is still in pre-series phase, samples can be ordered by contacting the SECO sales channel. For availability, samples and project pricing on the RE88-DISS-2-PK heat sink, please contact our sales team.
Downloads & documentation
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