Product description
The SECO SOM-COMe-CT6-Dragonwing-IQ-X (manufacturer part number EF31-2621-1121-I0_50) is a computer-on-module in the COM Express 3.1 Type 6 Compact form factor (95 × 95 mm), built on the Qualcomm Dragonwing IQ-X series for compute-intensive embedded and edge AI systems.
SOM-COMe-CT6-Dragonwing-IQ-X at a glance
SECO lists the module under base code F31. The series is offered with the Dragonwing IQ-X7181MD (12 Oryon cores) or IQ-X5121MD (8 Oryon cores) processor, both running at up to 3.4 GHz; memory configuration and temperature grade depend on the assembly variant.
Configuration & key features
- Form factor: COM Express 3.1 Type 6, Compact (95 × 95 mm)
- AI and graphics: Qualcomm Hexagon NPU with up to 45 TOPS, Adreno GPU with up to 3.8 TFLOPS
- Memory (series): up to 64 GB LPDDR5 (4224 MT/s) on the SiP, optional UFS 4.0 up to 1 TB, microSD slot
- Displays: up to four independent displays via DP, DDI and eDP or LVDS
- Interfaces: 2× USB4, PCIe Gen4 including x8 on the PEG pins, Ethernet up to 2.5 Gbit/s with TSN
- Operating systems: Windows 11 IoT Enterprise, Yocto Linux
- Temperature range (series): 0 to +60 °C (commercial) or −40 to +85 °C (industrial)
Typical applications
The module targets edge AI systems, industrial vision and multi-display applications on a standard COM Express carrier board. Browse more modules in System-on-Modules (SOM/CoM) or explore Industrial Vision & Edge AI.
Design note
Processor variant, memory size and temperature grade differ by manufacturer part number. Please confirm the right configuration with us before ordering samples.
Our application engineers support you with selection, samples and integration – request design-in support.
Downloads & documentation
Technical question? Talk to our FAEs.
Our Field Application Engineers support you with platform selection, integration and the path to series production – across manufacturers.
