Vision Technology & AI

Why choose Atlantik Elektronik for HMI Vision?

  • Camera modules & optics: MIPI CSI-2/USB3, ISP tuning, lens/IR-filter selection
  • Depth sensing: ToF range/accuracy, temperature & crosstalk compensation
  • Interfaces: MIPI, USB3 UVC, GMSL2; sync for multi-camera setups
  • AI/software: GStreamer/OpenCV pipelines, edge acceleration
  • Mech/thermal: mounts, EMC, cooling, sealed fronts
  • Privacy: privacy-by-design, on-device inference
 

Engineering Services to accelerate your project

  • FoV/lens & IR illumination design (850/940 nm)
  • Camera/ToF calibration (intrinsic/extrinsic)
  • ISP/NR/AE/AWB tuning, low-latency pipelines
  • Gesture/face/people models, HMI integration
  • Mechanical integration, EMC pre-compliance
 

Can’t find what you need? — Get in touch

Need specific sensors, baselines or synchronization? We source special variants, propose alternatives and build custom designs.

Contact:
info@atlantikelektronik.com
+49 89 895050

S-Cube
Manufacturer: meerecompany
MPN: S100D - S.CUBE Evaluation Kit (with USB 3.0 & MIPI interface)
  • The S.CUBE Time of Flight Sensor (ToF) module provides high-speed, real-time 3D depth raw data.
  • The S.CUBE module is a 3D ToF development kit with VCSEL IR illumination.
  • S.CUBE is a module of compact size with ASIC and MIPI interface on board (Optional: USB 3.0) - Important: The development kit is delivered with a USB interface!
  • Thanks to its compact board design it is designed for easy system integration.
295,00 EUR
plus 19% tax excl. Shipping costs
S110D
Manufacturer: meerecompany
MPN: S110D
The Wide Eye ToF Dev Kit module delivers raw 3D depth data at high speed and in real time.
The Wide Eye ToF Module l is a 3D ToF development kit with VCSEL IR illumination. The Dev Kit is a compact size module with ASIC companion chip (raw data conversion) and equipped with a MIPI and USB 3.0 interface.
Thanks to its compact board design, it is designed for easy system integration.

285,00 EUR
plus 19% tax excl. Shipping costs
ML-X LiDAR Sensor LiDAR Module for 3D image
MPN: ML-X LiDAR

Sensor LiDAR Module for 3D image and computer vision
Introducing the ML: The Future of LiDAR for Autonomous Driving
The ML redefines LiDAR sensors for the next generation of vehicles. This innovative solid-state design features:

Unmatched Simplicity: The world's simplest LiDAR with no moving parts, maximizing production efficiency and reliability.
Powerhouse Performance: Packed into a compact, lightweight design, the ML delivers exceptional performance for precise monitoring of a vehicle's surroundings.
Mass Production Ready: The simple design allows for easy integration and mass production, making widespread adoption possible.
The ML paves the way for safer, more intelligent autonomous vehicles.
Price on request
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FAQ

RGB vs ToF — what’s the difference?

RGB provides color images for detection/classification; ToF provides depth for distance/gesture. Combined they enable robust 2D/3D HMIs.

Which interfaces are available?

MIPI CSI-2 for direct SoM attach, USB3 UVC for hosts, GMSL2 for longer distances and synchronized multi-camera setups.

Do I need IR illumination?

For ToF/NIR applications typically 850/940 nm. We size output, optics and safety distances.

How low can latency go?

With optimized GStreamer/OpenCV pipelines and edge acceleration we achieve low end-to-end latency—sensor/SoC dependent.

How is calibration performed?

Intrinsic/extrinsic calibration (cam/ToF), temperature-drift correction and self-checks to keep depth data stable.