Development Kits

Manufacturer: Digi International
MPN: XK3-C-N1-UT-E
Includes:

• 1 Digi XBee3 Cellular LTE-M/NB-IoT embedded modem
• 1 Digi XBee3 development board
• Antennas and power supply

Manufacturer: Digi International
MPN: XK3-Z8S-WZM
Includes:

• 3 Digi XBee Grove Development Boards
• 3 Digi XBee3 ZigBee SMT Modules
• 3 Micro-USB Cables
• 3 Antennas

Manufacturer: Qualcomm
MPN: DK-SMART-AUDIO-APQ8009-0-A

• Wi-Fi certified SoM featuring the APQ8009 processor and containing key system components
• Best in class connectivity with 2x2 MIMO 802.11ac, Bluetooth® 4.2 with profiles such as A2DP (SBC, AAC, MP3, aptX), HFP and AVRCP
• High-quality Bluetooth/Wi-Fi coexistence through separate Bluetooth and Wi-Fi signal paths
• Reference speaker casing with bi-amped, two-way speakers

Manufacturer: Silex Technology
MPN: SX-SDCAC-2830-SP

The Silex SX-SDCAC SD card form factor is a next generation 802.11a/b/g/n/ac plus Bluetooth SDIO card based on the QCA9377 System-on-Chip (SoC) with Link rate upto 433 Mbps (1x1).

Manufacturer: Silex Technology
MPN: SX-SDCAC-2832+-SP

The Silex SX-SDCAC Plus is a next generation 802.11a/b/g/n/ac plus Bluetooth SDIO card based on the QCA9377-3 System-on-Chip (SoC). The SX-SDCAC Plus is mechanically designed in a SD card form factor to provide customers with a vendor independent form factor.

Manufacturer: Qualcomm
MPN: DK-QCC5121-WLCSP81-A-0

Development Kit for the Qualcomm QCC5121 Bluetooth Audio SoC

Manufacturer: Qualcomm
MPN: DK-QCC3026-WLCSP81-A-0

Development Kit for the Qualcomm QCC3026 Bluetooth Audio SoC