Qualcomm Development Kits

MPN: EVK-IQ8275-Starter-2Manufacturer: Qualcomm

• Evaluation kit for Dragonwing IQ-8275: Development platform for industrial IoT, edge AI and robotics applications.
• AI acceleration: Qualcomm® Hexagon™ Tensor Processor with up to 40 dense TOPS AI performance.
• High-performance platform: Octa-core CPU, 12 GB LPDDR5 with link ECC and 128 GB UFS storage.
• Camera and vision support: Processing of up to three concurrent 4K video streams and 3x MIPI CSI C/D-PHY flex connectors.
• Connectivity: Onboard Wi-Fi 6E, Bluetooth® 5.3, RJ45 2.5 GbE, PCIe x4 and M.2 E-Key.
• Display and multimedia interfaces: 2x mini-DP, DSI flex connection, 4K video decode and 2x 4K video encode.
• Embedded Linux support: Ubuntu and Upstream Linux with Yocto support for prototyping and production-oriented embedded development.

• Concept: High-performance development kit for edge AI, robotics, and computer vision designs based on the Qualcomm Dragonwing™ QCS8550
• Configuration: Core kit variant with 48 TOPS AI performance, Adreno™ 740 GPU, Spectra™ 680 ISP, 12 GB LPDDR5x, 128 GB UFS 3.1, and 96Boards-compatible high-speed and low-speed expansion
• Use case: Suitable for service robotics, deep learning, face detection, object detection and avoidance, surveillance, and industrial or automation applications
• Development focus: Fast evaluation of AI, vision, multimedia, and sensor workloads on a high-performance edge-computing platform
• Design note: Core Kit serves as the base configuration for AI and I/O development; the subsequent Vision Kit expands this platform specifically with CSI camera hardware

Manufacturer: Thundercomm

MPN: Qualcomm® RB5 Gen 2 Development Kit (Vision Kit)

• Concept: Vision-oriented high-performance development kit for edge AI, robotics, and computer vision designs based on the Qualcomm Dragonwing™ QCS8550
• Configuration: Vision kit variant built on the RB5 Gen 2 Core Kit, extended with a CSI camera bracket, high-resolution CSI camera, and low-resolution CSI camera
• Use case: Suitable for computer vision, service robotics, deep learning, face detection and recognition, object detection and avoidance, and surveillance applications
• Development focus: Direct entry into vision-centric AI workloads with included camera hardware for evaluation, prototyping, and application-oriented validation
• Design note: Compared with the Core Kit, the Vision Kit is the more suitable option when image sensors and CSI-based vision pipelines are part of the development setup from the outset

• Complete vision and AI development kit for real-world conditions
• Combines Rubik Pi 3 edge AI platform with ToF i200 depth camera
• 12.5 TOPS AI performance at the edge
• Sunlight-robust 3D depth sensing
• Ideal for robotics, autonomy and industrial perception
• Accelerates prototyping and time-to-market

• 5G Smart Module Development Kit for C6490 (QCs6490 / QCM6490)

• Development kit based on the Thundercomm TurboX I615 platform
• Designed for edge AI and embedded vision applications
• Rich set of interfaces for cameras, sensors and peripherals
• Enables fast prototyping and evaluation
• Supports modern Linux and Android software stacks
• Suitable for industrial, robotic and smart device designs

• Concept: High-performance development kit for edge AI, vision, and multimedia applications with strong on-device intelligence
• Configuration: Based on Qualcomm® Dragonwing™ Q-7790 with 24 TOPS AI, octa-core CPU, Adreno 722 GPU, triple ISP, and rich high-speed I/O for camera, display, and networking designs
• Use case: Suitable for rapid evaluation, prototyping, and product development in smart cameras, video collaboration, embedded vision, HMI, and multimedia edge systems
• Development focus: Combines local AI acceleration, advanced multimedia processing, and development-friendly interfaces for product-oriented edge AI designs
• Design note: Align camera setup, MIPI display integration, HDMI signal paths, storage expansion, and wireless/network architecture with the target design before release

• Flexible displays: 1× HDMI OUT (4K), 1× DisplayPort 1.4 over USB-C, additional HS connector
• Audio-ready: 2× speaker-out, 3.5-mm jack, HDMI IN/OUT with audio (via I²S), 2× DMIC (up to 8 DMICs)
• Camera options: 2× 4-lane D-PHY (one for ASE camera), 2× 3-trio C-PHY (compatible with 4-lane D-PHY), 2× GMSL
• Plenty of I/O: USB 3.1 Type-C, 3× USB 3.0 Type-A, 2× Micro-USB (debug), TF slot, SIM slot, fan header
• Networking & wireless: 2× 1000M Ethernet, M.2 slot for Thundercomm 5G module, SDIO Wi-Fi 5 module
• Sensors: A+G sensor (accelerometer+gyro) and magnetometer, 5× LEDs
• Industry-ready: −35…+75 °C, dimensions 201×162.5×35.6 mm