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Development Kits

Dragonwing development kits enable fast prototyping & PoCs—including camera/display I/O, sample apps and AI demos for vision and HMI.

Why choose our Development Kits?

Ready to run: preconfigured BSPs, sample pipelines & tools
Peripherals: MIPI camera, touch display, sensors & I/O
Docs & demos: quickstart, app samples, benchmarking tips
Transferable: reference designs toward your production hardware
Support: troubleshooting, drivers, performance tuning

Engineering Services

Use-case scoping & KPIs (latency, FPS, accuracy, power)
Driver/kernel customization, camera/touch tuning
AI/ML pipeline optimization & quantization
Transition to carrier-board/system design

Can’t find the kit you need?

Need a specific camera or display size? We source special variants and propose alternatives.

Contact: info@atlantikelektronik.com · +49 89 895050

Thundercomm - Qualcomm RB3 Gen 2 Vision Kit

Manufacturer: Thundercomm
MPN: Qualcomm RB3 Gen 2 Vision Kit

599,00 EUR

plus 19% tax excl. Shipping costs

SC200E (QCM2290) Development kit

Manufacturer: JMO
MPN: SC200E (QCM2290) Development kit

Unveiling the QCM2290: Power, Efficiency, and Affordability for Your IoT Projects
The Qualcomm QCM2290 is an SoC (system-on-chip) designed to be the workhorse of your next-generation IoT device. Here's how it delivers:

Long-lasting Performance:
- Built on an energy-saving 11nm process
- QCM2290 offers improved battery life compared to previous generations
- Reliable Processing Power via a quad-core 2.0 GHz Cortex-A53 CPU
- Smooth operation for your IoT application.
- Enhanced Multimedia, richer visuals with the Adreno 702 GPU
- The dual Image Signal Processor (ISP) supports up to 13-megapixel cameras, allowing for improved image quality in your devices.
Always Connected with LTE cellular data support, along with Wi-Fi and Bluetooth connectivity options.
Cost-Conscious Design: The QCM2290 prioritizes affordability, making it a perfect choice for entry-level IoT devices without compromising on essential features.
Ready-to-Go Kit

Say goodbye to compatibility headaches. Our dev kit comes with everything you need right out of the box, including essential connectors, cables etc

177,45 EUR

plus 19% tax excl. Shipping costs

Qualcomm® RB3 Gen 2 Lite Core Kit

Manufacturer: Thundercomm
MPN: Qualcomm RB3 Gen 2 Lite Core Kit

Processor: Qualcomm® QCM5430/QCS5430, Octa-Core ARM Cortex-A78
Graphics: Adreno™ 640 GPU
RAM: 4 GB LPDDR4x
Memory: 32 GB eMMC
Connectivity:

Wi-Fi 6E (802.11ax)
Bluetooth 5.2
Gigabit Ethernet

Interfaces:

2x USB 3.0, 1x USB-C
MIPI CSI (camera)
MIPI DSI (display)
GPIOs, I2C, SPI, UART

Audio: Support for multiple audio codecs, microphone and speaker connections
Power supply: 5V via USB-C, maximum power consumption 10W
Dimensions: 100 mm x 100 mm, weight approx. 200 g
Operating system: Support for Android and Linux-based distributions
Development support: Standardized software stack, support for common IDEs
Application areas: Robotics, industrial automation, intelligent cameras, drones, retail

389,00 EUR

plus 19% tax excl. Shipping costs

Rubik Pi 3 - Edge AI Platform

Manufacturer: Thundercomm
MPN: Rubik Pi 3

The RUBIK Pi is a lightweight development board based on the Qualcomm® QCS6490 platform. It is the first Pi built on Qualcomm AI platforms for developers.

The RUBIK Pi is compatible with a range of operating systems, including Android, Linux and LU, and is equipped with SDKs from Thundercomm to enhance the developer experience. The Qualcomm® QCS6490 offers excellent AI performance at 12.5 TOPS, and can be paired with the Qualcomm AI Hub to enable developers to experience first-hand the impact of AI evolution.

RRP 179,00 EUR
Only 99,00 EUR

plus 19% tax excl. Shipping costs

TurboX C8750 Development Kit

MPN: TurboX - C8750 Development Kit
Manufacturer: Thundercomm

Flexible displays: 1× HDMI OUT (4K), 1× DisplayPort 1.4 over USB-C, additional HS connector
Audio-ready: 2× speaker-out, 3.5-mm jack, HDMI IN/OUT with audio (via I²S), 2× DMIC (up to 8 DMICs)
Camera options: 2× 4-lane D-PHY (one for ASE camera), 2× 3-trio C-PHY (compatible with 4-lane D-PHY), 2× GMSL
Plenty of I/O: USB 3.1 Type-C, 3× USB 3.0 Type-A, 2× Micro-USB (debug), TF slot, SIM slot, fan header
Networking & wireless: 2× 1000M Ethernet, M.2 slot for Thundercomm 5G module, SDIO Wi-Fi 5 module
Sensors: A+G sensor (accelerometer+gyro) and magnetometer, 5× LEDs
Industry-ready: −35…+75 °C, dimensions 201×162.5×35.6 mm