EMASS – ECS-DoT Low Power AI SoC Development Kit

The ECS-DoT is an ultra-low-power, application-ready Edge-AI SoC that brings intelligence to the sensor edge—where size, power and latency matter most. With dual deep-learning accelerators, a 32-bit RISC-V control core, and built-in model decompression (~1.3 bits/weight), it performs real-time audio, vision and sensor workloads in compact, battery-powered devices.

Key Features & Benefits

Ultra-low power: inference at milli-watt levels (~5 mW), enabling always-on use cases.
Dual DL accelerators: around 30 GOPs, tuned for highly-compressed networks (~1.3 bits/weight).
32-bit RISC-V control: with floating-point; ~50 MHz typical (DK note).
On-chip memory: up to 4 MB total (2 MB SRAM + 2 MB MRAM) — no external DRAM required.
On-device sensor fusion: audio, vision & sensors without cloud latency and with improved privacy.
Tiny package: 5 × 5 mm QFN with minimal BOM and simple system design.
Competitive edge: up to 93% faster while using 90% less energy vs. leading competitors.

Typical Applications

Wearables, hearables & smart-home sensors (always-on voice/keyword, fall detection)
Camera sensor nodes, people/object detection, edge vision
Industrial sensing & predictive maintenance (vibration, acoustic, multi-sensor fusion)
Drones, robotics & autonomous systems (tight latency & energy budget)

Technical Specifications

Compute engine	32-bit RISC-V control core (~50 MHz typical) + dual DL accelerators; audio, vision & sensor-fusion
Compressed models	~1.3 bits/weight (built-in decompression) for larger networks in small memory
On-chip memory	Up to 4 MB total: 2 MB SRAM + 2 MB MRAM (non-volatile, power-gated); no external DRAM
Interconnect	High-bandwidth ~12 GB/s, 16 parallel access ports (DK note)
Power	<1–5 mW active (AI inference); fine-grained power-gating for long battery life
System I/O	I²C, I²S, UART, QSPI, CPI (camera), 32× GPIOs
Package	QFN, 5 × 5 mm
BOM/Integration	Minimal BOM, simplified system design

Dev Kit & Software

Evaluation platform: reference/eval board for rapid prototyping.
SDK & tools: EMASS AI Toolkit to port & optimize your models onto the DL accelerators.

FAQ

Do I need external DRAM?

No—the SoC integrates up to 4 MB on-chip memory (2 MB SRAM + 2 MB MRAM).

What sensor types are supported?

Audio (I²S), camera (CPI) and general sensors via I²C/SPI/UART/GPIO—ideal for multimodal on-device fusion.

Is always-on operation feasible?

Yes—the platform targets milli-watt inference for always-on use while outperforming competitors in energy and speed.

GPSR

Information:
The product was launched on the market by the manufacturer before December 13, 2024
and was offered for sale by us before December 13, 2024.
The product conforms to Directive 2001/95/EC.