Qualcomm - IQ8300

Qualcomm - IQ8300

The Qualcomm IQ8 Series powers compute-heavy and AI-based devices and is designed to operate in an expanded temperature range. It features built-in safety functions and rich peripheral support, ensuring powerful and efficient workload processing in demanding industrial environments.

Enhanced by on-device AI, the Qualcomm IQ8 Series delivers industrial-grade AI performance of up to 40 TOPS, an octa-core Qualcomm® Kryo™ Gen 6 CPU, a powerful Qualcomm® Adreno™ 623 GPU, and support for up to 12 concurrent cameras, as well as 4K video encode and decode across multiple displays. It also includes a dedicated safety island or real-time subsystem and can operate in extreme industrial conditions ranging from -40°C to +125°C, making it ideal for a wide range of intelligent, reliable, compute-heavy industrial applications.

Features:
- Integrated Qualcomm® Hexagon™ Tensor Processor with Hexagon DSP, a quad Hexagon Vector eXtensions (HVX) processor, and dual Hexagon Matrix eXtensions (HMX) coprocessors, delivering up to 40 TOPS to support high-performance, AI-centric, and generative AI industrial use cases.
- Multi-OS support for the Qualcomm® Linux® software stack and Ubuntu.
- Safety features to support safety goals, including support for ECC (Error Correction Code) memory and a dedicated safety island with real-time cores.
- Designed for use in extremely harsh industrial environments with a wide operating temperature range of -40°C to +125°C.
- Adreno Video Processing Unit (VPU) 623: Fifth-generation Ultra HD video processing unit for high-quality 4K video encode (up to 4K85) and decode (up to 4K135). Includes native decode support for HEVC, H.265, H.264, AV1, and VP9, as well as native encode support for HEVC, H.265, and H.264.
- Octa-core processor with four high-performance CPU cores, four efficiency CPU cores, a GPU, and a Hexagon Tensor Processor with vector and matrix extensions to manage various concurrent compute and AI workloads.
- Rich in peripherals, including integrated Ethernet with TSN, PCIe, Wi-Fi, Bluetooth, and USB.
- Built-in MCU subsystem that can replace or enhance external MCUs, offering design flexibility and reduced BOM costs.