Qualcomm® S7 and S7 Pro Gen 1 Sound Platforms
Qualcomm® S7 and S7 Pro Gen 1 Sound Platforms
The S7 and S7 Pro Gen 1 Sound platforms deliver six times more compute power, and almost 100 times more AI power than previous generation platforms, with advanced connectivity options and Snapdragon Sound, in an ultra-low power architecture. They have been designed to deliver a new premium tier of performance unlike anything listeners have heard before.The S7 Pro Platform also includes a worldclass Wi-Fi solution that will extend the capability and range of audio devices far beyond what is possible with only Bluetooth, whilst maintaining the ultra-low power performance we have come to expect from earbuds and headsets. To do this, we have leveraged our rich heritage and expertise in Wi-Fi connectivity to deliver a dedicated Wi-Fi solution for earbuds and headphones.
The Qualcomm® S7 Pro Platform (Qualcomm® QCC7226 + QCP7321) is the first to support micro-power Wi-Fi connectivity and our revolutionary new Qualcomm® Expanded Personal Area Network (XPAN) which transform the sound experience by enabling whole home and building coverage, supporting up to 192 kHz lossless music streaming and enhanced sound for gaming with spatial audio.
Powerful on-device AI and the Qualcomm neural network accelerator enables a stepchange in concurrent processing at ultra-low power. Working in conjunction with Active Noise Cancellation and Personal Sound Amplification technologies, the on-device AI enables earbuds and headsets to become much more responsive to listener needs, environment, and preferences as they transition throughout their day.
In addition to this, the platform is packed with premium audio technologies, including Qualcomm® 4th Gen Adaptive Active Noise Cancellation (ANC) and fully programmable, low-latency DSP to provide powerful ANC, as well as enabling hearing loss compensation and personal sound amplification products.
Qualcomm® S7 and S7 Pro Gen 1 Sound Platforms
• All new platform architecture unlocks a new tier of performance, maintaining ultra-low power performance
• Almost 100x more AI power than the Qualcomm® S5 Gen 2 Sound Platform
• 3x more memory than the Qualcomm® S5 Gen 2 Sound Platform
• A step-change in DSP – 1.5 GHz total audio compute (50%+ improvement on previous S5 Gen 2 Sound Platform)
• Dedicated AI core to provide higher performance and lower power for ML applications compared to using the DSP • Dedicated cores for audio curation including hearing loss compensation, ANC, transparency, and noise management
• Hi-Fi-grade stereo audio codec
• 4th Generation Qualcomm Adaptive Active Noise Cancellation 112 biQuad filters combined with fully programmable 3uSec low latency DSP to enable personalized and responsive audio curation
• Bluetooth 5.4 radio and Bluetooth® LE Audio experiences, including Auracast™ Broadcast Audio
• USB High Speed PHY at 480 Mbps which unlocks enhanced Audio Development workflows
• Non-invasive, low-level debug through use of Qualcomm USB-EUD
• Enhanced memory and peripheral data sharing across subsystems for lower latency and higher throughputs
• DMIC, I2S, TDM, and Soundwire digital audio interfaces
• Fully integrated system including PMU, charger, mic bias, and external supply support
• High-performance audio combined with low power consumption, designed for Snapdragon Sound
Qualcomm® S7 Pro Gen 1 Additional Features
• Support for Wi-Fi connectivity at micro-power
Support for whole home and building coverage with Qualcomm XPAN Technology
• Seamless transitions to Wi-Fi from Bluetooth
• Data rates of up to 29 Mpbs, supporting Snapdragon Sound and delivering up to 24-bit 192 kHz lossless music streaming over Wi-Fi
• Almost 100x more AI power than the Qualcomm® S5 Gen 2 Sound Platform
• 3x more memory than the Qualcomm® S5 Gen 2 Sound Platform
• A step-change in DSP – 1.5 GHz total audio compute (50%+ improvement on previous S5 Gen 2 Sound Platform)
• Dedicated AI core to provide higher performance and lower power for ML applications compared to using the DSP • Dedicated cores for audio curation including hearing loss compensation, ANC, transparency, and noise management
• Hi-Fi-grade stereo audio codec
• 4th Generation Qualcomm Adaptive Active Noise Cancellation 112 biQuad filters combined with fully programmable 3uSec low latency DSP to enable personalized and responsive audio curation
• Bluetooth 5.4 radio and Bluetooth® LE Audio experiences, including Auracast™ Broadcast Audio
• USB High Speed PHY at 480 Mbps which unlocks enhanced Audio Development workflows
• Non-invasive, low-level debug through use of Qualcomm USB-EUD
• Enhanced memory and peripheral data sharing across subsystems for lower latency and higher throughputs
• DMIC, I2S, TDM, and Soundwire digital audio interfaces
• Fully integrated system including PMU, charger, mic bias, and external supply support
• High-performance audio combined with low power consumption, designed for Snapdragon Sound
Qualcomm® S7 Pro Gen 1 Additional Features
• Support for Wi-Fi connectivity at micro-power
Support for whole home and building coverage with Qualcomm XPAN Technology
• Seamless transitions to Wi-Fi from Bluetooth
• Data rates of up to 29 Mpbs, supporting Snapdragon Sound and delivering up to 24-bit 192 kHz lossless music streaming over Wi-Fi
Information on product safety:
- Only suitable for technically experienced users who are familiar with the product.
- Only suitable for the intended use.
- Improper use can lead to damage and injury.
- Observe the manufacturer's further safety instructions.
Manufacturer
Qualcomm Technologies International, Ltd.
Churchill House Cambridge Business Park
Cowley Road
Cambridge CB4 0WZ
United Kingdom
https://www.qualcomm.com/
Responsible Person for the EU
Atlantik Elektronik GmbH
Fraunhoferstr. 11a
82152 Planegg
Germany
info@atlantikelektronik.com