Product description
The RE81-DISS-1-MPK is a dissipator kit (heat spreader) from Seco with 1.5 mm height, listed in the official manufacturer price list for the SMARC E81 module family SOM-SMARC-QCS6490 / SOM-SMARC-QCS5430 and supplied as a multi-pack.
Further technical details on the dissipator kit itself (material, dimensions, mounting) are available on request.
The associated SMARC E81 modules are based on the SMARC 2.1.1 form factor with dimensions of 82 x 50 mm and feature Qualcomm Dragonwing processors (QCS6490 or QCS5430).
Note for procurement
Compatibility of the RE81-DISS-1-MPK applies, per the manufacturer, to the SMARC E81 module family SOM-SMARC-QCS6490 / SOM-SMARC-QCS5430. Request availability, project pricing and design-in support via our contact page.
Technical question? Talk to our FAEs.
Our Field Application Engineers support you with platform selection, integration and the path to series production – across manufacturers.
