Industry 5.0

Manufacturer: Atlantik Elektronik GmbH
MPN: Industrial AI Camera Solution

Key Features:

• Advanced AI: Accurate measurements, defect detection, object recognition.
• Powerful Processing: Fast image analysis and processing.
• Flexible Integration: Seamlessly connect to existing systems.
• Durable Design: Built for harsh environments.
• User-Friendly: Easy to set up and operate.

Benefits:

• Improved Efficiency: Faster inspections, reduced costs.
• Enhanced Quality: Consistent, accurate quality control.
• Increased Productivity: Faster production cycles.
• Cost Savings: Optimized resource allocation.
• Enhanced Traceability: Track product information.
• Let's discuss how our technology can benefit your business.

Manufacturer: Thundercomm
MPN: Rubik Pi 3

The RUBIK Pi is a lightweight development board based on the Qualcomm® QCS6490 platform. It is the first Pi built on Qualcomm AI platforms for developers.

The RUBIK Pi is compatible with a range of operating systems, including Android, Linux and LU, and is equipped with SDKs from Thundercomm to enhance the developer experience. The Qualcomm® QCS6490 offers excellent AI performance at 12.5 TOPS, and can be paired with the Qualcomm AI Hub to enable developers to experience first-hand the impact of AI evolution.

Manufacturer: ProLabs
MPN:  SFP-10G-SR-C

MPN: LOQ-9075IQ-EVK
Manufacturer: Lantronix

• Open-Q™ 9075IQ SOM with 36 GB LPDDR5 ECC RAM
• Qualcomm Kryo™ Gen 6 octa-core CPU + Adreno™ 663 GPU
• AI acceleration: up to 100 INT8 TOPs on-device
• Supports 16 simultaneous camera streams
• LLM capable: up to 22 tokens/sec with LLaMA 27B
• Fault-tolerant ECC memory + real-time subsystem
• Industrial-grade: –40 °C to +90 °C operating range

MPN: TCOM - AR1 Reference Design 
Manufacturer: Thundercomm

 

MPN: EMASS - ECS-DoT Low Power AI SoC DK
Manufacturer: EMASS
 

• Ultra-low power: inference at milli-watt levels (~5 mW), enabling always-on use cases.
• Dual DL accelerators: around 30 GOPs, tuned for highly-compressed networks (~1.3 bits/weight).
• 32-bit RISC-V control: with floating-point; ~50 MHz typical (DK note).
• On-chip memory: up to 4 MB total (2 MB SRAM + 2 MB MRAM) — no external DRAM required.
• On-device sensor fusion: audio, vision & sensors without cloud latency and with improved privacy.
• Tiny package: 5 × 5 mm QFN with minimal BOM and simple system design.
• Competitive edge: up to 93% faster while using 90% less energy vs. leading competitors.