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SECO

SOM-COMe-BT6-MTL COM Express Module – Seco EE59-4020-2121-C1_50

HAN: EE59-4020-2121-C1_50 SKU: ATE143160
Seco EE59-4020-2121-C1_50 is a COM Express 3.1 Type 6 Basic module from the SOM-COMe-BT6-MTL series featuring an Intel Core Ultra 7 155H (Meteor Lake-H), 256GB PCIe SSD, LVDS and CSI interface, and TPM 2.0. The manufacturer supplies this part exclusively as an Engineering Sample for development use, not for field deployment.
1.692,80 €
excl. 19% VAT , Free shipping
  • Lead time on request
FAE support included (B2B-Projects) Invoice, PayPal & prepayment

Product description

Seco EE59-4020-2121-C1_50 is a COM Express 3.1 Type 6 Basic module from the SOM-COMe-BT6-MTL series (E59 product family), equipped with an Intel Core Ultra 7 155H processor (codename Meteor Lake-H) and supplied as an Engineering Sample with a 256GB PCIe SSD, LVDS display interface, CSI camera connector, and TPM 2.0.

SOM-COMe-BT6-MTL Overview

The module integrates an Intel Xe LPG graphics controller with up to 128 EU and two DDR5 SO-DIMM slots supporting DDR5-5600 IBECC memory for up to 64GB, and the manufacturer specifies an operating temperature range of 0°C to +60°C for the commercial version, measured at any point of the heatspreader; actual temperature will widely depend on application, enclosure and environment, so application-specific cooling must be considered by the customer.

Configuration & Features

  • Processor: Intel Core Ultra 7 155H (Meteor Lake-H) per the official manufacturer list; per datasheet with 6 P-Cores + HT @1.4GHz (turbo 4.8GHz) and 8 E-Cores @0.9GHz (turbo 3.8GHz), 24MB cache
  • Storage per manufacturer list: onboard PCIe NVMe SSD, 256GB; Mass Storage Description: Up to 2x SATA Gen3.2 channels (factory alternative to on-board NVMe + 1 PEG x4), optional on-board NVMe SSD (PCIe x4 interface) up to 512GB
  • Display/camera per manufacturer list: LVDS interface and CSI camera connector; 1x eDP or single-/dual-channel 18-/24-bit LVDS interface (factory alternatives), 2x MIPI CSI channels with a single on-board connector (factory option)
  • Security: TPM 2.0 onboard per manufacturer list; TPM 2.0 on-board (factory option) per datasheet
  • System bus per manufacturer list: eSPI; eSPI or LPC bus (factory alternatives) per datasheet
  • Networking: 1x NBase-T Ethernet interface with Intel I226 GbE controller, supporting 2.5GbE and TSN
  • Dimensions: 125 x 95 mm, COM Express Basic form factor, Type 6 pinout

Typical Applications

COM Express Type 6 modules are widely used in industrial automation, medical, and computer vision applications, with the datasheet also listing Medical, Industrial Automation, Smart Devices, and Digital Signage as main fields of application. Related SOM/CoM products are listed under System-on-Modules (SOM/CoM), and solution guidance for edge AI use cases under Industrial Vision & Edge AI.

Procurement note

This part is listed by the manufacturer as an Engineering Sample and is supplied exclusively for development and evaluation purposes, not for series or field deployment. Information on remaining availability, production release, or successor configurations is available on request. For design-in consultation, sample requests, and current availability, contact our sales team.

Downloads & documentation

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