SOM-COMe-BT6-RPL-P COM Express Module – Seco ME03-1021-2021-I3

The SOM-COMe-BT6-RPL-P is a COM Express® Type 6 (R3.1) computer-on-module from Seco with manufacturer part number ME03-1021-2021-I3, fitted with an Intel Core i7-13800HRE processor (13th generation, codename Raptor Lake-H) for the industrial temperature range.

SOM-COMe-BT6-RPL-P overview

The module is based on the 13th generation Intel Core processor family (codename Raptor Lake-P/H) with a hybrid core architecture combining Performance and Efficient cores, and supports up to 64 GB of DDR5-4800 memory with IBECC. It belongs to the E03 (CALLISTO) product family and is implemented as a COM Express Basic module in the Type 6 form factor.

Configuration & features

• CPU: Intel Core i7-13800HRE, 14 cores (6P+8E), up to 5.00 GHz turbo, 96 EU graphics, 24 MB cache, 45 W TDP, vPro, IBECC, BGA1744, industrial version
• Memory: two DDR5 SO-DIMM slots, DDR5-4800 with IBECC, up to 64 GB
• Mass storage for this variant: on-board 128 GB PCIe NVMe 3D FerriSSD (I-temp, TLC mode) as a factory alternative to one PEG x4 Gen4 interface, plus 2x SATA Gen3
• Factory configuration of this part number: PCIe packet switch, LVDS interface in the industrial temperature range, TPM 2.0 (SLB 9670, configuration A0, industrial) and LPC bus
• Graphics: Intel UHD/Iris Xe graphics with up to 96 execution units, driving up to four independent displays
• Networking: 1x NBase-T interface with up to 2.5GbE via Intel I225 controller with TSN support
• USB/PCIe: up to 2x USB4 Gen2, 4x USB 3.2 Gen2, 8x USB 2.0 plus PEG x8 Gen4, up to 2x PEG x4 Gen4 and up to 8x PCIe x1 Gen3
• Form factor: COM Express Basic Type 6, 125 x 95 mm; operating temperature of the industrial version -40 °C to +85 °C, measured at the heatspreader

Typical application areas

With its industrial temperature range and compute performance, the module is suited for industrial vision and edge AI as well as further projects in the System-on-Modules (SOM/CoM) category.

Note for development

The COM Express module must be mounted on an application-specific carrier board; PCIe lane grouping and the choice between LVDS and eDP signals are set via factory configuration options and/or BIOS settings. Pinout, power supply, thermal design and BIOS setup details are provided in the manufacturer's user manual.

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