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SECO

SOM-COMe-CT6-Dragonwing-IQ-X COM Express Type 6 SOM – Seco EF31-7621-1121-I0_50

HAN: EF31-7621-1121-I0_50 SKU: ATE143015
The SOM-COMe-CT6-Dragonwing-IQ-X is a COM Express 3.1 Type 6 Compact module from Seco built around the Qualcomm Dragonwing IQ-X processor; this variant (manufacturer part number EF31-7621-1121-I0_50) ships with the IQX5121MD-1-AC SiP, 64 GB LPDDR5 and 256 GB UFS 4.1 storage. Seco supplies this unit as an Engineering Sample for development purposes, not for field deployment.
1.498,00 €
excl. 19% VAT , Free shipping
  • Lead time on request
FAE support included (B2B-Projects) Invoice, PayPal & prepayment

Product description

The SOM-COMe-CT6-Dragonwing-IQ-X is a COM Express® 3.1 Type 6 Compact module from Seco, supplied in variant EF31-7621-1121-I0_50 with the Qualcomm®-Dragonwing™-IQX5121MD-1-AC SiP (8-core SoC X1P-42-100), 64 GB LPDDR5 memory and 256 GB UFS 4.1 storage. According to the manufacturer list, this configuration additionally includes an LVDS display output, CAN interface, CSI camera connectivity, a USB hub, TPM 2.0, and a Realtek RTL8111KI Ethernet controller with 1 Gbps over PCIe.

SOM-COMe-CT6-Dragonwing-IQ-X Overview

SECO SOM-COMe-CT6-Dragonwing-IQ-X is a Computer on Module (CoM) COM Express® 3.1 Type 6 Compact based on Qualcomm® Dragonwing™ IQ-X Series of processors in SiP-A (Dragonwing™ IQ-X7181MD or IQ-X5121MD), featuring a Qualcomm Hexagon NPU with up to 45 TOPS. For ordering purposes, the module is referred to by its base code, "F31".

Configuration & Features

  • CPU: Qualcomm® Dragonwing IQ-X Series with Hexagon NPU, up to 45 TOPS; Graphics: Qualcomm® Adreno™ GPU, up to 3.8 TFLOPS; Memory: up to 64 GB LPDDR5-4224 integrated on SiP; Connectivity: 1× NBase-T Ethernet.
  • SiP fitted in this variant: IQX5121MD-1-AC with 8-core SoC X1P-42-100 (manufacturer list)
  • Mass storage of this variant: UFS 4.1 with 256 GB (manufacturer list); Seco's product page states a general series option of UFS 4.0 up to 1 TB
  • Display/interface equipment of this variant per manufacturer list: LVDS output, CAN bus, CSI camera interface, USB hub, TPM 2.0, and Realtek RTL8111KI Ethernet controller (PCIe, 1 Gbps)
  • COM Express Compact form factor measuring just 95 x 95 mm
  • Industrial-grade variants of the series are specified for operation from -40°C to +85°C

Typical Applications

The module targets developers evaluating a COM Express Type 6 SOM with a Qualcomm Dragonwing processor for industrial vision and Edge AI applications. Further system-on-modules are available in the System-on-Modules (SOM/CoM) category.

Procurement Note

According to the manufacturer, the SOM-COMe-CT6-Dragonwing-IQ-X is currently in the prototype phase; samples can only be ordered through the Seco sales channel. SECO limits the use of Engineering Samples exclusively to evaluation, test, development, and prototyping purposes; deployment as part of a product, including pre-production qualification and certification testing, is strictly prohibited. Engineering Samples are sold "as-is" with no warranty of any kind, neither explicit nor implied. Residual availability and information on a possible successor are available on request. For Design-In support, samples, and project pricing, please contact our team.

Downloads & documentation

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