Product description
The SOM-COMe-CT6-Dragonwing-IQ-X COM Express Type 6 module from Seco (manufacturer part number EF31-2621-1121-I0_50) is a COM Express 3.1 Type 6 Compact module based on the Qualcomm Dragonwing IQ-X processor in SiP-A, currently offered as an Engineering Sample for development.
SOM-COMe-CT6-Dragonwing-IQ-X overview
The module belongs to Seco's F31 product family and combines a Qualcomm Dragonwing IQ-X processor with a Qualcomm Hexagon NPU delivering up to 45 TOPS of on-device AI acceleration in the COM Express 3.1 Type 6 Compact form factor (95 × 95 mm).
Configuration & features
- Processor: Qualcomm Dragonwing IQ-X7181MD-1-AB (SiP-A) with 64-bit X1E-78-100 SoC, 12-core Oryon CPU up to 3.4 GHz
- AI acceleration: Qualcomm Hexagon NPU with up to 45 TOPS
- Memory on this variant: 32 GB LPDDR5, integrated on the SiP
- Storage on this variant: UFS, 256 GB
- Display/video interface: LVDS
- Further interfaces: CAN, CSI, USB hub, TPM 2.0, Realtek RTL8111KI PCIe Ethernet controller at 1 Gbps
- Form factor: COM Express 3.1 Type 6 Compact
Typical application areas
The module targets developers of industrial PCs, HMI systems and AI-driven automation who need edge AI compute in a COM Express form factor, for example in industrial vision & edge AI. Further modules of this form factor are listed under System-on-Modules (SOM/CoM).
Procurement note
According to the manufacturer, the SOM-COMe-CT6-Dragonwing-IQ-X is currently in the prototype phase. Samples are provided exclusively as Engineering Samples via the Seco sales channel for development purposes, not for field deployment; software and documentation status are not yet fully finalized according to the manufacturer. Contact us for availability and design-in support.
Downloads & documentation
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