Product description
The Seco RE39-DISS-1-MPK is a dissipator kit (heat spreader) for the SOM-SMARC-MX93 SMARC module of the E39 product family, listed in the official manufacturer price list as a multi-pack.
SOM-SMARC-MX93 Dissipator Kit Overview
The kit belongs to Seco's DIS product line and is assigned to the SOM-SMARC-MX93 SMARC module (product family E39). This module is based on the NXP i.MX 9 processor with an ARM Cortex-A55 quad-core and is implemented in the SMARC Rel. 2.1.1 form factor measuring 50 x 82 mm.
Configuration & Features
- Product line per manufacturer: DIS (dissipator / heat spreader)
- Associated module: SOM-SMARC-MX93, product family E39
- Packaging per official manufacturer list: multi-pack
- Designed for SMARC modules with NXP i.MX 9 processor, ARM Cortex-A55 quad-core
- Form factor of the associated module: SMARC Rel. 2.1.1, dimensions 50 x 82 mm
- Per manufacturer, a SECO heat spreader is generally intended only as a supplemental means of heat transfer, not as a standalone cooling system
Typical Applications
According to the manufacturer, the associated SOM-SMARC-MX93 module is used in medical devices, fleet management solutions, EV charging stations and industrial machines. Matching accessories such as this dissipator kit are listed in the Power Supplies & Enclosures for Embedded Computing category, with related application examples under Industry solutions.
Note for Procurement
A publicly available datasheet specifically for the multi-pack variant RE39-DISS-1-MPK could not be located; configuration details and drawings are available on request. Compatibility with the SOM-SMARC-MX93 is a manufacturer specification.
Please contact the ATE sales team for availability, samples and project pricing.
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