Search for: Robotics

• Concept: High-performance development kit for edge AI, robotics, and computer vision designs based on the Qualcomm Dragonwing™ QCS8550
• Configuration: Core kit variant with 48 TOPS AI performance, Adreno™ 740 GPU, Spectra™ 680 ISP, 12 GB LPDDR5x, 128 GB UFS 3.1, and 96Boards-compatible high-speed and low-speed expansion
• Use case: Suitable for service robotics, deep learning, face detection, object detection and avoidance, surveillance, and industrial or automation applications
• Development focus: Fast evaluation of AI, vision, multimedia, and sensor workloads on a high-performance edge-computing platform
• Design note: Core Kit serves as the base configuration for AI and I/O development; the subsequent Vision Kit expands this platform specifically with CSI camera hardware

Manufacturer: Thundercomm

MPN: Qualcomm® RB5 Gen 2 Development Kit (Vision Kit)

• Concept: Vision-oriented high-performance development kit for edge AI, robotics, and computer vision designs based on the Qualcomm Dragonwing™ QCS8550
• Configuration: Vision kit variant built on the RB5 Gen 2 Core Kit, extended with a CSI camera bracket, high-resolution CSI camera, and low-resolution CSI camera
• Use case: Suitable for computer vision, service robotics, deep learning, face detection and recognition, object detection and avoidance, and surveillance applications
• Development focus: Direct entry into vision-centric AI workloads with included camera hardware for evaluation, prototyping, and application-oriented validation
• Design note: Compared with the Core Kit, the Vision Kit is the more suitable option when image sensors and CSI-based vision pipelines are part of the development setup from the outset

• Complete vision and AI development kit for real-world conditions
• Combines Rubik Pi 3 edge AI platform with ToF i200 depth camera
• 12.5 TOPS AI performance at the edge
• Sunlight-robust 3D depth sensing
• Ideal for robotics, autonomy and industrial perception
• Accelerates prototyping and time-to-market

• Concept: Compact SBC QSM-board for edge computing, HMI, and multimedia designs based on the QSM668SR system with Qualcomm QCM6125
• Configuration: WF variant with 4 GB RAM, 64 GB storage, Kryo 260 octa-core, Adreno 610 GPU, 1.1 TOPS NPU, and support for Android, Linux, and Ubuntu
• Use case: Suitable for intelligent displays, IoT gateways, robotics, smart home, industrial HMIs, and embedded multimedia applications with local wireless connectivity
• Development focus: High-performance application platform with multimedia, camera, and peripheral connectivity for product-oriented embedded and edge AI development
• Design note: This WF version is based on the SC668S-WF and is the variant focused on Wi-Fi and Bluetooth; the following QSM668SR-EM 4+64GB addresses the cellular LTE configuration instead

• Next-gen Edge AI Domain Controller based on Qualcomm® QCS9100
• Up to 200 INT8 TOPS AI compute + Adreno 663 GPU
• 12× camera support, 5× radar, 12× USS
• 12 display outputs, up to 48 MP
• 8× CAN-FD, Automotive Ethernet, integrated IMU
• Designed for −40°C to +85°C harsh environments
• Ideal for robotics, autonomous vehicles & industrial intelligence

• Dual-brain architecture: Qualcomm Dragonwing™ IQ8 (QCS8275) + STM32H5F5 for deterministic real-time actuation
• AI compute: Hexagon Tensor AI Processor (NPU) with up to 40 Dense TOPS
• Memory & storage: 16GB LPDDR5 (2×8GB) + 64GB eMMC, M.2 NVMe Gen4 expansion
• Connectivity: Wi-Fi® 6 (2.4/5/6 GHz), Bluetooth® 5.3, 2.5Gbit Ethernet
• Adapter-free I/O: USB-C (host/device + DP Alt Mode video), 2× USB 3.0 Type-A, HDMI, MIPI CSI / MIPI DSI via carrier headers
• Industrial/robotics I/O: CAN-FD (PHY on screw terminal) plus additional CAN-FD lines via headers, JOMEGA expansion
• Ecosystem: Raspberry Pi® HATs (40-pin), Arduino® UNO shields/carriers, Qwiic/Modulino® + 8×13 LED matrix
• Software: Linux (Debian/Ubuntu), Arduino Core on Zephyr OS, Docker/Docker Compose, Arduino App Lab

Manufacturer: Quectel

MPN: QSM200UPWFNA-4G64-PI-M1

• SBC board based on the Qualcomm SM6115 platform with 4GB LPDDR4X and 64GB eMMC.
• ARM octa-core 64-bit processor with 4x A73 @ 2.0 GHz and 4x A53 @ 1.8 GHz.
• Adreno 610 GPU for multimedia, HMI, and edge workloads.
• Wi-Fi, Bluetooth 5.0, USB, HDMI, Ethernet, camera, and other embedded interfaces.
• Linux, Android, and Ubuntu are supported at platform level.
• Suitable for edge computing, robotics, industrial automation, digital signage, and multimedia terminals.

• M12 X-Code female jack to RJ45 plug
• Cat6 Ethernet up to 10 Gbps
• Durable TPE jacket for harsh environments
• Supports PROFINET, EtherCAT, Modbus, Ethernet
• 12-inch cable length (custom lengths available)
• Reliable for vibration-heavy and industrial environments

• Qualcomm QCM6490 Octa-Core SBC (1.9–2.7 GHz)
• Adreno 643 GPU & 12 TOPS NPU
• 5G Sub-6, Wi-Fi 6E, Bluetooth 5.2 & GNSS
• Rich industrial I/O including USB, RS232, RS485, CAN, Ethernet, HDMI & MIPI CSI
• Supports Ubuntu 20.04, Android 13* and Windows 11*
• Low-power operation with Auto-Power-On, Wake-on-LAN & Watchdog
• Optional WiFi-only configuration available

• Based on the Qualcomm® QRB5165 System-on-Chip
• 5th generation AI engine
• Ubuntu 18.04 Linux

• based on the Qualcomm® SXR2130P SoC
• 15 trillion operations per second
• Wi-Fi 6 connectivity

• Drone Reference Platform (DRP) to accelerate development, validation, testing, and prototyping of UAV designs
• Based on Lantronix Open-Q™ 8550CS µSOM with Qualcomm® Dragonwing™ QCS8550
• Flight-ready with Pixhawk 6X flight controller and PX4 support
• Advanced AI vision with FLIR Hadron 640R thermal camera + on-device AI for detection/tracking
• SWaP-optimized (size, weight & power) for UAV applications
• Linux Yocto and Qualcomm Hexagon™ Tensor Processor (HTP) for on-device AI
• Multiple MIPI cameras and multiple wireless connectivity options

Manufacturer: ArduinoMPN: ABX00162

• Hybrid platform with Qualcomm® Dragonwing™ QRB2210 MPU and STM32U585 real-time MCU
• 2GB LPDDR4 RAM and 16GB eMMC for Linux-based embedded and edge AI projects
• Arduino UNO compatible with classic UNO shields, new carriers, and Qwiic expansion
• AI, vision, and audio capabilities for object recognition, voice commands, motion detection, and more
• Arduino App Lab for unified development using Arduino Sketches, Python®, and preloaded AI models
• Wi-Fi® 5, Bluetooth® 5.1, USB-C, LED matrix, and high-speed headers for versatile prototyping and product development tasks

• Qualcomm Kryo™ Gen 6 Octa-Core + Adreno™ 663 GPU
• 36 GB LPDDR5 ECC RAM for industrial robustness
• Up to 100 INT8 TOPs via Qualcomm AI Engine™
• Supports LLMs like LLaMA 27B at 22 tokens/sec
• 16 concurrent video streams (ISP)
• Real-time subsystem for safety-critical tasks
• Operating range: –40 °C to +90 °C
• TAA-compliant for public sector use

• 18 GB LPDDR5 ECC RAM (TAA-compliant)
• Qualcomm Kryo™ Gen 6 Octa-Core CPU + Adreno™ 663 GPU
• Up to 100 INT8 TOPs with Qualcomm AI Engine™
• Supports LLMs like LLaMA 27B (22 tokens/sec)
• Processes up to 16 camera streams simultaneously
• Real-time subsystem & safety architecture
• Extended temperature: –40 °C to +90 °C

• Qualcomm Dragonwing™ QCS6490 platform
• Up to 12 Dense TOPS edge AI performance
• Global 5G + Wi-Fi 6E connectivity
• 8GB RAM, 64GB UFS storage
• PoE++ Ethernet & industrial interfaces
• Designed for vision & physical AI workloads

• Qualcomm Dragonwing™ IQ615 platform
• Up to 3 Dense TOPS AI performance
• Global 5G cellular modem
• Wi-Fi 6E (2.4/5/6 GHz)
• 4GB RAM, 64GB UFS storage
• Industrial PoE++ and I/O interfaces

• LGA sample variant for evaluation, design-in and early integration phases
• Compact LGA form factor with 18 × 28.5 × 3.15 mm dimensions
• Hostless microprocessor architecture simplifies integration without an external host MCU
• Dual-band Wi-Fi 6 / 802.11ax with 2.4 GHz and 5 GHz support
• Bluetooth Low Energy 5.4 with central and peripheral roles
• Fast Ethernet with integrated 10/100BASE-T Ethernet PHY
• Dual U.FL antenna for Wi-Fi and BLE functions
• Enterprise Wi-Fi security with EAP / 802.1X
• Concurrent Soft AP + client mode for direct service access without disrupting field operations
• Can operate as a network co-processor or wireless MCU
• Interfaces according to part-number description: Fast Ethernet, serial, USB, I2C, SPI, SDIO, GPIO
• Pre-integrated with Lantronix Percepxion™ cloud-based IoT edge solution
• Industrial-grade operating temperature range from -40 °C to +85 °C

• LGA tape-and-reel variant for serial production, manufacturing planning and bulk sourcing
• Packaging unit: 500 pieces according to the official part-number description
• Compact LGA form factor with 18 × 28.5 × 3.15 mm dimensions
• Hostless microprocessor architecture simplifies integration without an external host MCU
• Dual-band Wi-Fi 6 / 802.11ax with 2.4 GHz and 5 GHz support
• Bluetooth Low Energy 5.4 with central and peripheral roles
• Fast Ethernet with integrated 10/100BASE-T Ethernet PHY
• Dual U.FL antenna for Wi-Fi and BLE functions
• Enterprise Wi-Fi security with EAP / 802.1X
• Concurrent Soft AP + client mode for direct service access without disrupting field operations
• Can operate as a network co-processor or wireless MCU
• Interfaces according to part-number description: Fast Ethernet, serial, USB, I2C, SPI, SDIO, GPIO
• Pre-integrated with Lantronix Percepxion™ cloud-based IoT edge solution
• Industrial-grade operating temperature range from -40 °C to +85 °C