Lantronix

• Qualcomm Dragonwing™ IQ615 platform
• Up to 3 Dense TOPS AI performance
• Global 4G LTE + Wi-Fi 6E
• 4GB RAM, 64GB UFS storage
• PoE++ Ethernet & industrial I/O
• Designed for vision and automation workloads

• 1 Port Remote KVM-over-IP with USB Connectors; 58” VGA cable

• Wireless gateway including 1 year of ConsoleFlow premium services and LEVEL 2 technical services; with antennas and power supply

• Worldwide - LTE-M Gateway including 1 year of ConsoleFlow Premium Services and LEVEL 2 Technical Services; with antennas and power supply

• EMEA/APAC - LTE Cat 1 gateway including 1 year of ConsoleFlow Premium services and LEVEL 2 technical services; with antennas and power supply

• With MODBUS
• Without Encryption

• LGA sample variant for evaluation, design-in and early integration phases
• Compact LGA form factor with 18 × 28.5 × 3.15 mm dimensions
• Hostless microprocessor architecture simplifies integration without an external host MCU
• Dual-band Wi-Fi 6 / 802.11ax with 2.4 GHz and 5 GHz support
• Bluetooth Low Energy 5.4 with central and peripheral roles
• Fast Ethernet with integrated 10/100BASE-T Ethernet PHY
• Dual U.FL antenna for Wi-Fi and BLE functions
• Enterprise Wi-Fi security with EAP / 802.1X
• Concurrent Soft AP + client mode for direct service access without disrupting field operations
• Can operate as a network co-processor or wireless MCU
• Interfaces according to part-number description: Fast Ethernet, serial, USB, I2C, SPI, SDIO, GPIO
• Pre-integrated with Lantronix Percepxion™ cloud-based IoT edge solution
• Industrial-grade operating temperature range from -40 °C to +85 °C

• LGA tape-and-reel variant for serial production, manufacturing planning and bulk sourcing
• Packaging unit: 500 pieces according to the official part-number description
• Compact LGA form factor with 18 × 28.5 × 3.15 mm dimensions
• Hostless microprocessor architecture simplifies integration without an external host MCU
• Dual-band Wi-Fi 6 / 802.11ax with 2.4 GHz and 5 GHz support
• Bluetooth Low Energy 5.4 with central and peripheral roles
• Fast Ethernet with integrated 10/100BASE-T Ethernet PHY
• Dual U.FL antenna for Wi-Fi and BLE functions
• Enterprise Wi-Fi security with EAP / 802.1X
• Concurrent Soft AP + client mode for direct service access without disrupting field operations
• Can operate as a network co-processor or wireless MCU
• Interfaces according to part-number description: Fast Ethernet, serial, USB, I2C, SPI, SDIO, GPIO
• Pre-integrated with Lantronix Percepxion™ cloud-based IoT edge solution
• Industrial-grade operating temperature range from -40 °C to +85 °C

MPN: XPC600300SManufacturer: Lantronix

• Tray packaging for production, serial deployment and bulk sourcing
• Packaging unit: 200 pieces according to the provided product information
• Hostless microprocessor architecture simplifies integration without an external host MCU
• Dual-band Wi-Fi 6 / 802.11ax with 2.4 GHz and 5 GHz support
• Bluetooth Low Energy 5.4 with central and peripheral roles
• Fast Ethernet with integrated 10/100BASE-T Ethernet PHY
• Dual U.FL antenna for Wi-Fi and BLE functions
• Enterprise Wi-Fi security with EAP / 802.1X
• Concurrent Soft AP + client mode for direct service access without disrupting field operations
• Can operate as a network co-processor or wireless MCU
• Interfaces according to part-number description: Fast Ethernet, serial, USB, I2C, SPI, SDIO, GPIO
• Pre-integrated with Lantronix Percepxion™ cloud-based IoT edge solution
• Industrial-grade operating temperature range from -40 °C to +85 °C

• Hostless microprocessor architecture simplifies integration without an external host MCU
• Dual-band Wi-Fi 6 / 802.11ax with 2.4 GHz and 5 GHz support
• Bluetooth Low Energy 5.4 with central and peripheral roles
• Fast Ethernet with integrated 10/100BASE-T Ethernet PHY
• Dual U.FL antenna for Wi-Fi and BLE functions
• Enterprise Wi-Fi security with EAP / 802.1X
• Concurrent Soft AP + client mode for direct service access without disrupting field operations
• Can operate as a network co-processor or wireless MCU
• Interfaces according to part-number description: Fast Ethernet, serial, USB, I2C, SPI, SDIO, GPIO
• Pre-integrated with Lantronix Percepxion™ cloud-based IoT edge solution
• Industrial-grade operating temperature range from -40 °C to +85 °C

MPN: XPC600100EKManufacturer: Lantronix

• Hostless microprocessor architecture simplifies integration without an external host MCU
• Dual-band Wi-Fi 6 / 802.11ax with 2.4 GHz and 5 GHz support
• Ethernet connectivity with integrated 10/100BASE-T Ethernet PHY
• Bluetooth Low Energy 5.4 for industrial IoT and embedded applications
• Enterprise Wi-Fi security with EAP / 802.1X
• Concurrent Soft AP + client mode for direct service access without disrupting field operations
• Can operate as a network co-processor or wireless MCU
• Pre-integrated with Lantronix Percepxion™ cloud-based IoT edge solution
• Supports secure device updates and CRA-oriented lifecycle management
• Industrial-grade operating temperature range from -40 °C to +85 °C
• Approvals / compliance for USA, Canada, EU, Japan, Taiwan, China and India

• Minimal engineering effort required to web-enable virtually any electronic device
• Remote command and control of edge devices
• EM C/EMI -compliant; RoHS-compliant
• Everything you need – all in a single RJ45 pack

• Industrial Device Server with Installable Industrial Protocols, DIN Rail Mount, Serial Interface (RS-232/RS-422/RS-485 - terminal block or RJ45), 10Base-T/100Base-TX, 9-30VDC/9-24VAC, RoHS