Bluetooth

Manufacturer: Thundercomm
MPN: Qualcomm Robotics RB1 Development Kit (Core Kit)

Manufacturer: Lantronix
MPN: G526GP12S

• for Industry 4.0, security and transport applications
• LTE Cat 4 and 5G mobile gateways
• User-friendly ConsoleFlow™ device management

Manufacturer: Quectel  
PN: RM500QAE

Quectel RM500Q AE
Highest integration - lowest engineering effort. A 5G module based on Qualcomm X55 chipset with global certification as a pluggable M.2 form factor card.
EM C / EMI compliant; RoHS compliant

Manufacturer: Panorama Antennas
MPN: DMM-6-60-2SP

• 4G 5G LTE capable antenna with fallback to 2G/3G
• Desktop, window and wall mounting options
• Lightweight, portable plug-and-play solution
• Up to 5dBi peak gain
• Multiple mounting options
• Integrated coaxial cable with plug connectors
• Lightweight and easy to use
• Unique X design for efficient MiMo performance
• Cost effective 4G/5G LTE antenna
• Failover protection
• Trade & Commerce
• Travel

Manufacturer: Quectel Wireless Solutions
MPN: SC200REMNA-E51-UGNDA
Highest integration - lowest possible engineering effort. A SmartPhone as an industrial module for practically all electronic devices.
Display, camera, remote control and control of edge devices.
EM C / EMI -compliant; RoHS Compliant 

Manufacturer: Sparklan
MPN: AP6275P

• Wi-Fi 6 - Dual-stream spatial multiplexing up to 1200 Mbps data rate
• PCIe v3.0 Interface
• Client MU-MIMO
• Bluetooth 5.0

Manufacturer: Sparklan
MPN: AP6275S

• Wi-Fi 6 - Dual-stream spatial multiplexing up to 1200 Mbps data rate
• SDIO Interface
• Client MU-MIMO
• Bluetooth 5.0

Manufacturer: Sparklan
MPN: WPEQ-262ACNI(BT)

• Chipset: Qualcomm Atheros QCA6174A-5
• Antenna: 2xIPEX MHF4 connectors, 2T2R
• Interface: PCIe: WLAN; USB: Bluetooth
• Output Power up to 18dBm
• OS-Support: Win7/8.1/10,Linux (Kernel v4.0+ recommended)