Bluetooth

Manufacturer: Sparklan
MPN: WPEQ-261ACNI(BT)

• Chipset: Qualcomm QCA6174A-5
• Antenna: 2xIPEX connectors, 2T2R
• Form Factor: Half Mini PCIe
• Interface: PCIe: WLAN; USB: Bluetooth

Manufacturer: Sparklan
MPN: WNFT-234ACN(BT)

• Supports multiple drivers (Android/Windows/Linux)
• BT transmission speed including 1M, 2M and 3Mbps EDR operations
• Support for Simple Pairing (SP) and Enhanced Inquiry Response (EIR) functions
• Supports MU-MIMO
• Wi-Fi Supports Low Power PCIe (w/ L1 substate) interfaces
• Two-stream spatial multiplexing up to 867Mbps data rate

Manufacturer: Silex Technology
MPN: SX-SDCAC-2830-SP

The Silex SX-SDCAC Evaluation Card form factor SD development card is a next-generation 802.11a/b/g/n/ac plus Bluetooth SDIO card based on the QCA9377 system-on-chip (SoC) with a link rate of up to 433 Mbps (1x1).

• IEEE 802.11a/b/g/n/ac compliance
• Based on the QCA9377-3 chipset
• SDIO 3.0 WLAN host interface
• EEE 802.11e, IEEE 802.11h and IEEE 802.11i
• Link rate up to 433 Mbps (1x1)
• On-board and u.fl antenna options
• Wave 2 client-side MIMO support
• Bluetooth 4.1 BR/EDR/LE "Smart Ready
• SD card form factor enables easy evaluation

Manufacturer: Silex Technology
MPN: SX-SDCAC-2832+-SP

The Silex SX-SDCAC Plus is a next generation 802.11a/b/g/n/ac plus Bluetooth SDIO card based on the QCA9377-3 System-on-Chip (SoC). The SX-SDCAC Plus is mechanically designed in a SD card form factor to provide customers with a vendor independent form factor.

Manufacturer: Qualcomm
MPN: DK-TRBI200-CE684-1

• ​TRANSACT. Brdg  I/F High-Speed, Debug  Adaptor / Programmer

Manufacturer: Sierra Wireless
MPN: BX3100 Dev Kit

• Wi-Fi and Bluetooth 4.2 pre-certified module
• Simple and fast integration with free unlimited FOTA and built-in cloud connectivity
• Ideal for quickly and cost effectively adding wireless communication

Manufacturer: Sierra Wireless
MPN: BX3105 Dev Kit

• Wi-Fi and Bluetooth 4.2 pre-certified module
• Simple and fast integration with free unlimited FOTA and built-in cloud connectivity from AirVantage®
• Module supports 802.11 b/g/n and dual-mode Bluetooth Classic and Bluetooth Low Energy 
• Designed in an industrial-grade common flexible form factor (CF3®)