Product description
The QD62-DISS-1-I-MPK is a passive heat spreader from Seco for the Qseven Computer-on-Module SOM-Q7-EHL from the ATLAS/D62 product family with Intel Atom processors, supplied in the industrial version and as a multi-pack.
According to the manufacturer, a heat spreader in this product group serves as a supplemental means of heat dissipation and is not a standalone, guaranteed cooling system; designing an application-specific cooling solution remains the responsibility of the customer. The operating temperature ranges stated by the module manufacturer are measured at any point of the associated Seco standard heatspreader.
The SOM-Q7-EHL, for which this heat spreader is intended, belongs to the product portfolio for embedded computing applications within Embedded Computing.
For detailed technical information, availability and project pricing on the QD62-DISS-1-I-MPK, please contact us via our contact page.
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