Qualcomm - IQ-615
Qualcomm - IQ-615
The Qualcomm IQ6 Series delivers powerful industrial-grade performance across a wide temperature range, offering efficient compute capabilities, AI workload processing, and rich peripheral support, including Wi-Fi, Ethernet, and USB, tailored for industrial devices in the entry and mid-tier segments.
Qualcomm IQ6 Series provides industrial-grade performance and features for building intelligent edge computing devices, such as industrial gateways, controllers, machine vision systems, HMIs, and more, in a cost-effective manner. It integrates a powerful image signal processor (ISP) and the Qualcomm® AI Engine, along with a heterogeneous compute architecture that includes a highly optimized CPU, GPU, and DSP, delivering industrial-grade AI performance for the entry to mid-tier segment.
Features:
- Qualcomm® Kryo™ 460 CPU with a 64-bit Octa-Core processor
- Qualcomm Spectra™ 230 ISP
- Qualcomm® Adreno™ 612 GPU
- Thermal junction (Tj) temperature range of -40°C to +105°C allows deployment in demanding industrial environments
- Adreno Video Processing Unit (VPU) 443 featuring 4K60 decode and 1080p60 encode with native support for H.265/H.264, VP8, VP9 (decode)
The Qualcomm IQ6 Series delivers powerful industrial-grade performance across a wide temperature range, offering efficient compute capabilities, AI workload processing, and rich peripheral support, including Wi-Fi, Ethernet, and USB, tailored for industrial devices in the entry and mid-tier segments.
Qualcomm IQ6 Series provides industrial-grade performance and features for building intelligent edge computing devices, such as industrial gateways, controllers, machine vision systems, HMIs, and more, in a cost-effective manner. It integrates a powerful image signal processor (ISP) and the Qualcomm® AI Engine, along with a heterogeneous compute architecture that includes a highly optimized CPU, GPU, and DSP, delivering industrial-grade AI performance for the entry to mid-tier segment.
Features:
- Qualcomm® Kryo™ 460 CPU with a 64-bit Octa-Core processor
- Qualcomm Spectra™ 230 ISP
- Qualcomm® Adreno™ 612 GPU
- Thermal junction (Tj) temperature range of -40°C to +105°C allows deployment in demanding industrial environments
- Adreno Video Processing Unit (VPU) 443 featuring 4K60 decode and 1080p60 encode with native support for H.265/H.264, VP8, VP9 (decode)
Qualcomm - IQ-615
Technology: 11 nm FINFET low power
Kryo CPU Architecture: 64-bit Octa-Core
Cores: 2x Kryo4 Gold @ 1.9 GHz + 6x Kryo4 Silver-lite @ 1.6 GHz
Memory Architecture: 2x 16-bit LPDDR4x 1555 MHz, up to 8 GB
GPU, Video, and Display: Adreno 612 GPU
APIs: OpenGL ES3.2, OpenCL 2.0, DX12FL9.3, Vulkan 1.x
Video Decode: 4K 60fps 10-bit: HEVC/H.265, 8-bit VP9, VP8, and H.264
Video Encode: 1080p 60fps, 8-bit: HEVC/H.265, H.264, and VP8
Video Decode + Encode: 4K 30fps Decode + 1080p 30fps Encode
Display Resolutions: Up to a maximum of 5 MP, e.g., 2x 1920x1080 @ 60fps (FHD) + 1x 1280x720 @ 60fps
Display Interfaces: 1x 4-lane MIPI DSI-2 + 1x DP v1.4 (supports: SST and MST)
Camera Lanes: Up to 6 cameras over 3x 4-lane MIPI CSI-2 v1.3 (D-PHY 1.2, C-PHY 1.0)
Audio: Audio DSP (aDSP) Hexagon QDSP6 v66K @ 1.0 GHz
Audio Interfaces: Up to 5x I2S/PCM/TDM, 2x SLIMbus
I/O Interfaces:
- ETH AVB: 1x RGMII / RMII with MDIO GB ETH AVB (1V8 only)
- PCIe: 1-lane PCIe Gen 2 RC / EP
- USB: 1x USB 3.1 Gen 1 (SS), 1x USB 2.0 (HS) OTG
- Secure Digital Interfaces: 1x 4-bit SD/SDIO 3.0 (UHS-I), 1x 8-bit eMMC 5.1, 1-lane UFS2.1 Gear3 (UFS3.1 supported with UFS2.1 feature set), QSPI for boot
Software-Defined Radio: 2x high-speed I2S
Multiport SPI / I2C / UART: Up to 14x 4-wire QUPv3 (UART, I2C, SPI)
GPIOs: 100+ GPIOs
Package Balls, Dimensions: FCBGA761+HS: 23 x 23 x 2.45 mm (incl. metallic heat spreader); 0.8 mm pitch, non-PoP
Power Management: PMIC 1x PMM6155AU (0.8 mm pitch)
Vector DSP Compute: DSP (cDSP) Hexagon QDSP6 v66A @ 1.1 GHz, 2x HVX (vector extensions)
Connectivity: Optional Wi-Fi 6E 802.11ax 2x2 Dual MAC DBS + Bluetooth 5.3. Tri-band support of 2.4GHz, 5GHz, and 6GHz
Temperature Range: Junction Temp (Tj) -40°C to +105°C
Operating System: Multiple OS, Linux Yocto, Ubuntu
Build Design: Ball pitch FCBGA761+HS, 23 mm x 23 mm, 0.8 mm ball pitch
Technology: 11 nm FINFET low power
Kryo CPU Architecture: 64-bit Octa-Core
Cores: 2x Kryo4 Gold @ 1.9 GHz + 6x Kryo4 Silver-lite @ 1.6 GHz
Memory Architecture: 2x 16-bit LPDDR4x 1555 MHz, up to 8 GB
GPU, Video, and Display: Adreno 612 GPU
APIs: OpenGL ES3.2, OpenCL 2.0, DX12FL9.3, Vulkan 1.x
Video Decode: 4K 60fps 10-bit: HEVC/H.265, 8-bit VP9, VP8, and H.264
Video Encode: 1080p 60fps, 8-bit: HEVC/H.265, H.264, and VP8
Video Decode + Encode: 4K 30fps Decode + 1080p 30fps Encode
Display Resolutions: Up to a maximum of 5 MP, e.g., 2x 1920x1080 @ 60fps (FHD) + 1x 1280x720 @ 60fps
Display Interfaces: 1x 4-lane MIPI DSI-2 + 1x DP v1.4 (supports: SST and MST)
Camera Lanes: Up to 6 cameras over 3x 4-lane MIPI CSI-2 v1.3 (D-PHY 1.2, C-PHY 1.0)
Audio: Audio DSP (aDSP) Hexagon QDSP6 v66K @ 1.0 GHz
Audio Interfaces: Up to 5x I2S/PCM/TDM, 2x SLIMbus
I/O Interfaces:
- ETH AVB: 1x RGMII / RMII with MDIO GB ETH AVB (1V8 only)
- PCIe: 1-lane PCIe Gen 2 RC / EP
- USB: 1x USB 3.1 Gen 1 (SS), 1x USB 2.0 (HS) OTG
- Secure Digital Interfaces: 1x 4-bit SD/SDIO 3.0 (UHS-I), 1x 8-bit eMMC 5.1, 1-lane UFS2.1 Gear3 (UFS3.1 supported with UFS2.1 feature set), QSPI for boot
Software-Defined Radio: 2x high-speed I2S
Multiport SPI / I2C / UART: Up to 14x 4-wire QUPv3 (UART, I2C, SPI)
GPIOs: 100+ GPIOs
Package Balls, Dimensions: FCBGA761+HS: 23 x 23 x 2.45 mm (incl. metallic heat spreader); 0.8 mm pitch, non-PoP
Power Management: PMIC 1x PMM6155AU (0.8 mm pitch)
Vector DSP Compute: DSP (cDSP) Hexagon QDSP6 v66A @ 1.1 GHz, 2x HVX (vector extensions)
Connectivity: Optional Wi-Fi 6E 802.11ax 2x2 Dual MAC DBS + Bluetooth 5.3. Tri-band support of 2.4GHz, 5GHz, and 6GHz
Temperature Range: Junction Temp (Tj) -40°C to +105°C
Operating System: Multiple OS, Linux Yocto, Ubuntu
Build Design: Ball pitch FCBGA761+HS, 23 mm x 23 mm, 0.8 mm ball pitch
Information on product safety:
- Only suitable for technically experienced users who are familiar with the product.
- Only suitable for the intended use.
- Improper use can lead to damage and injury.
- Observe the manufacturer's further safety instructions.
Manufacturer
Qualcomm Technologies International, Ltd.
Churchill House Cambridge Business Park
Cowley Road
Cambridge CB4 0WZ
United Kingdom
https://www.qualcomm.com/
Responsible Person for the EU
Atlantik Elektronik GmbH
Fraunhoferstr. 11a
82152 Planegg
Germany
info@atlantikelektronik.com