SOM-COMe-BT6-RPL-P COM Express Module – Seco ME03-6021-1021-C3

The SOM-COMe-BT6-RPL-P ME03-6021-1021-C3 is a COM Express® Type 6 (R3.1) Basic Computer-on-Module by Seco featuring an Intel Core i5-13600HE processor (Raptor Lake-H) for the commercial temperature range.

SOM-COMe-BT6-RPL-P Overview

The module is based on the COM Express® Rel. 3.1 specification in Type 6 pinout and uses 13th Gen Intel Core processors (codename Raptor Lake-P/-H).

Configuration & Features (ME03-6021-1021-C3)

• Processor: Intel Core i5-13600HE (Raptor Lake H), 12 cores (4P+8E), 80 EU graphics, 18 MB cache, up to 4.80 GHz, vPro, 45 W TDP, BGA1744, Embedded Broad Market
• Mass storage: factory on-board NVMe SSD with 128 GB (3D FerriSSD, TLC mode, C-temp)
• Expansion: PCIe packet switch factory option
• Display: eDP interface as factory option
• Security: optional TPM 2.0 (SLB 9670 Q2.0, CFG A0, commercial variant)
• Bus option: LPC available
• Memory: two DDR5 SO-DIMM slots, DDR5-4800, up to 64 GB
• Networking: 2.5GbE interface via Intel I225 with TSN support
• Operating temperature: 0 °C to +60 °C (commercial version)
• Form factor: COM Express Basic, 125 x 95 mm

Typical Applications

COM Express modules of this class are suited for compute-intensive embedded and edge applications, for example in industrial vision and edge AI. Additional variants and accessories of this series can be found under System-on-Modules (SOM/CoM).

Note for Development

The configuration described refers to the manufacturer part number ME03-6021-1021-C3 (commercial-temp variant with eDP, NVMe and TPM option). For carrier board design, the manufacturer specifies a suitable heat spreader and application-specific cooling solutions.

For availability, sample requests and design-in support, please contact our team.