SOM-COMe-BT6-RPL-P Active Heat Sink – Seco ME03-DISS-3-PK

The ME03-DISS-3-PK is an active heat sink (Heat Sink, ACTIVE) from Seco for the COM Express Type 6 module SOM-COMe-BT6-RPL-P of the E03 series, supplied as a factory-packaged kit.

SOM-COMe-BT6-RPL-P Heat Sink Overview

According to the official manufacturer list, the accessory belongs to product line DIS and is assigned to product family E03, which covers the COM Express module SOM-COMe-BT6-RPL-P with 13th Gen Intel Core processors (codename Raptor Lake-P, also available in U and H series). The heat sink dissipates heat from this module so that the manufacturer-specified temperature range at the heat sink can be maintained.

Configuration & Features

• Manufacturer part number ME03-DISS-3-PK, product line DIS, product family E03
• Design: active heat sink (ACTIVE), factory-packaged kit (Packaged)
• Manufacturer-specified for use with the COM Express® 3.1 Type 6 basic module SOM-COMe-BT6-RPL-P
• Target module with 13th Gen Intel Core processors (Raptor Lake U/P/H series), up to 45 W TDP in the H series
• Module operating temperature per manufacturer: 0 °C to +60 °C (commercial version) or −40 °C to +85 °C (industrial version), measured at the heat sink

Typical Applications

Active heat sinks of this type are used in industrial embedded systems based on COM Express modules, for example in the Embedded Computing category and as mechanical equipment for system-on-modules in the Power Supplies & Enclosures category.

Note for Development

According to the manufacturer, compatibility of the ME03-DISS-3-PK is limited to the SOM-COMe-BT6-RPL-P (E03); Seco offers dedicated cooling solutions for other COM Express modules. Detailed technical data on the heat sink itself (dimensions, material, mounting method) are not available from official sources.

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