Product description
The Seco ME03-DISS-1-PK is a passive heat spreader for the COM Express module SOM-COMe-BT6-RPL-P from product family E03. According to the official Seco distributor list, it is a Com-Exp heat spreader for Raptor Lake processors in passive design, supplied packaged.
SOM-COMe-BT6-RPL-P accessory overview
Configuration & Features
- Product line DIS, manufacturer part number ME03-DISS-1-PK per the official Seco price list
- Design: passive heat spreader without fan or active cooling components
- Associated with product family E03, the product family of the COM Express® Type 6 module SOM-COMe-BT6-RPL-P with 13th Gen Intel® Core™ processors (codename Raptor Lake-P)
- Delivery form: packaged single part
Typical Applications
The heat spreader is used as mechanical accessory for the thermal design of COM Express assemblies, for example in industrial embedded systems based on the SOM-COMe-BT6-RPL-P. Matching carrier boards and further accessories for COM Express modules can be found in the Power Supplies & Enclosures category.
Note for Development
Seco states that the specified operating temperature range for the SOM-COMe-BT6-RPL-P module is measured at any point of Seco's standard heatspreader for this product, and that actual temperature widely depends on application, enclosure and environment; customers are advised to consider application-specific cooling solutions. Detailed technical values for the ME03-DISS-1-PK itself (dimensions, material) are not available from freely accessible manufacturer sources and can be requested.
For availability, sample requests and design-in support regarding the ME03-DISS-1-PK, contact Atlantik Elektronik.
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