SOM-COMe-CT6-Dragonwing-IQ-X Heat Sink – Seco MF31-DISS-3-MPK

The Seco MF31-DISS-3-MPK is an active heat sink for the COM Express Type 6 Compact module SOM-COMe-CT6-Dragonwing-IQ-X from Seco's F31 product family, listed in the official manufacturer price list as an Active Heat Sink in multi-pack packaging ("MULTI packaged").

SOM-COMe-CT6-Dragonwing-IQ-X Heat Sink Overview

The associated SOM-COMe-CT6-Dragonwing-IQ-X module is a Computer on Module (CoM) in COM Express 3.1 Type 6 Compact form factor based on Qualcomm Dragonwing IQ-X processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. For ordering purposes, the module is referred to by its base code, "F31".

Configuration & Features

• Active cooling solution (Active Heat Sink) per Seco's official ordering table for the F31 module.
• Supplied in multi-pack packaging according to the manufacturer price list.
• A fan connector has been placed on one side of the board to allow easier connection of active heat sinks to the module.
• The heat sink is designed to provide a cooling solution under constant airflow conditions, facilitated by a system fan, based on defined mechanical parameters.
• The heat spreader is not intended as a standalone cooling solution but as a supplemental mechanism for transferring heat to an external dissipation system (e.g., heat sinks, fans, heat pipes).

Typical Applications

The heat sink is intended for use with COM Express modules in industrial edge computing and edge AI applications, such as System-on-Modules (SOM/CoM).

Note for Procurement

The associated SOM-COMe-CT6-Dragonwing-IQ-X module is still in prototype phase; samples can be ordered by contacting the SECO sales channel. The exact packaging variant (single or multi-pack) and current lead times should be clarified per project. For availability, samples, and project pricing on the Seco MF31-DISS-3-MPK, please contact the ATE team.