COMe-F31-CT6 Active Heat Sink – Seco MF31-DISS-3-PK

The MF31-DISS-3-PK is the active heat sink (Active Heat Sink – Packaged) from Seco for the COM Express Type 6 Compact module SOM-COMe-CT6-Dragonwing-IQ-X, internally referred to as module family F31. It is listed as a separately orderable accessory in the module's official manufacturer part number table.

COMe-F31-CT6 Active Heat Sink Overview

Configuration & Features

• Manufacturer part number: MF31-DISS-3-PK, listed in the manual as "Active Heat Sink – Packaged"
• Intended for the COM Express® Type 6 Compact module SOM-COMe-CT6-Dragonwing-IQ-X, referred to by its base code "F31" for ordering purposes
• The associated module is based on Qualcomm® Dragonwing™ IQ-X series processors (IQ-X7181MD or IQ-X5121MD) with a Hexagon NPU delivering up to 45 TOPS
• Designed to provide cooling under constant airflow conditions, supplied by a system fan, based on defined mechanical parameters
• A fan connector is provided on the module to allow easier connection of active heat sinks
• As an alternative, Seco lists the passive heat spreader MF31-DISS-1-PK (Passive Heat Spreader – Packaged) in the same manufacturer part number table

Typical Applications

The heat sink is used wherever the COMe-F31-CT6 COM Express module is deployed in embedded computing designs with active cooling, such as edge AI and vision systems with high compute load, see Embedded Computing and Industrial Vision & Edge AI.

Note for Development

According to the manufacturer, the associated SOM-COMe-CT6-Dragonwing-IQ-X module is currently in the prototype phase; samples can be requested through the Seco sales channel. For design-in support, availability and samples of the MF31-DISS-3-PK, please use our contact form.