Product description
The MF31-DISS-1-MPK is a passive heat spreader from Seco for the COM Express Type 6 module SOM-COMe-CT6-Dragonwing-IQ-X from the F31 product family.
SOM-COMe-CT6-Dragonwing-IQ-X Heat Spreader Overview
The heat spreader belongs to Seco's DIS product line for cooling accessories and is intended for the COM Express Type 6 module SOM-COMe-CT6-Dragonwing-IQ-X. According to the official manufacturer list, it is a passive version without active fan cooling, shipped in a multi-pack packaging format.
Configuration & Features
- Manufacturer part number: MF31-DISS-1-MPK
- Product line: DIS (heat spreader / cooling accessory)
- Product family: F31 (COMe-F31)
- Design: passive, without active fan
- Packaging: multi-packaged according to manufacturer price list
- Target module: SOM-COMe-CT6-Dragonwing-IQ-X (COM Express Type 6)
Typical Applications
Passive heat spreaders of this type are used in embedded systems where the heat generated by a COM Express module needs to be transferred to an external cooling system without moving fan parts, for example in embedded computing designs.
Note for Procurement
Detailed values such as dimensions, weight, material, and maximum thermal dissipation are not available from the source used and can be provided on request. Contact Atlantik Elektronik for availability and project pricing.
Technical question? Talk to our FAEs.
Our Field Application Engineers support you with platform selection, integration and the path to series production – across manufacturers.
