Product description
The Seco MD40-DISS-3-PK is an active, factory-packaged heat sink (Heat Sink Active) for the COM Express® Type 6 Compact module SOM-COMe-CT6-TGL-U from the CALYPSO product family (D40). The accessory is supplied matched to the module configuration and provides thermal coupling to the processor during operation.
SOM-COMe-CT6-TGL-U Cooling Solution Overview
Configuration & Features
- Product type: Active heat sink (Heat Sink Active), packaged
- Manufacturer part number: MD40-DISS-3-PK
- Associated module: SOM-COMe-CT6-TGL-U
- Product family: CALYPSO (D40)
- Associated module is based on 11th Gen Intel® Core™ processors (codename Tiger Lake UP3)
- Application: COM Express® Rel. 3.0 Compact Type 6 Computer-on-Module (CoM)
Typical Applications
The heat sink is used together with the SOM-COMe-CT6-TGL-U module in industrial embedded systems, such as control and edge applications built on COM Express carrier boards. Matching modules and accessories can be found in the Embedded Computing category.
Note for Procurement
The heat sink is available as a separate, packaged accessory for the SOM-COMe-CT6-TGL-U module. Compatibility is stated solely as a manufacturer specification by Seco.
For availability, samples, and project pricing, contact Atlantik Elektronik.
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