SOM-COMe-CT6-TGL-U Heat Spreader (Passive) – Seco MD40-DISS-1-PK

The MD40-DISS-1-PK is a passive heat spreader (factory packaged) from Seco for the COM Express® Type 6 Compact module SOM-COMe-CT6-TGL-U of the CALYPSO series (D40 family).

SOM-COMe-CT6-TGL-U CALYPSO at a Glance

The associated module SOM-COMe-CT6-TGL-U is a COM Express® Rel. 3.0 Compact Type 6 Computer-on-Module (CoM) with 11th Gen Intel® Core™ (Tiger Lake UP3) processors, listed by Seco under the family name CALYPSO (D40). The heat spreader provides the thermal interface between the processor and a customer-defined cooling solution.

Configuration & Features

• Manufacturer part number MD40-DISS-1-PK, product line DIS, product family D40 (CALYPSO) per the official Seco price list
• Design: passive heat spreader, factory packaged
• Associated module: SOM-COMe-CT6-TGL-U – COM Express® Rel. 3.0 Compact Type 6 Computer-on-Module with 11th Gen Intel® Core™ (Tiger Lake UP3) processors
• Module form factor: 95 x 95 mm (COM Express™ Compact form factor, Type 6 pinout)
• Module operating temperature, measured at any point of the Seco standard heat spreader: 0°C to +60°C (commercial) / -40°C to +85°C (industrial)

Typical Applications

Heat spreaders of this type are used when building industrial embedded systems on COM Express modules, for example in Embedded Computing or in industrial vision & edge AI applications.

Note for Procurement

No standalone, publicly accessible product page with a product photo is currently available for MD40-DISS-1-PK; the information is based on the official Seco price list together with the product page and datasheet of the associated SOM-COMe-CT6-TGL-U module. Further mechanical details such as dimensions and material are available on request.

For availability, samples and project pricing on MD40-DISS-1-PK, contact the ATE sales team.