Product description
The Seco SOM-SMARC-TWL RE08-G842-2121-C3 is a SMARC® Rel. 2.1 system-on-module featuring an Intel® Core™ i3-N355 processor (codename Twin Lake), 16 GB dual-channel LPDDR5 memory and 64 GB eMMC flash.
SOM-SMARC-TWL Overview
The module belongs to Seco's E08 product family and is built on the SMARC® Rel. 2.1 form factor with dimensions of 50 x 82 mm. It is available with Intel N-series processors as well as the Intel® Core™ i3-N355; the variant described here, RE08-G842-2121-C3, uses the 8-core Intel® Core™ i3-N355.
Configuration & Features
- CPU: Intel® Core™ i3-N355, 8 cores, 1.9 GHz (up to 3.9 GHz turbo), 15 W TDP
- Graphics: Integrated Intel® graphics with up to 32 execution units @ 1350 MHz, up to 3 independent displays, resolution up to 4096 x 2160 @ 60 Hz
- Memory: 16 GB LPDDR5-4800 dual-channel, soldered down, with IBECC; 64 GB on-board eMMC
- Video: Dual-channel LVDS plus 2x DP++ (DP 1.4 / HDMI® 2.1 multimode)
- Networking: 2x Gigabit Ethernet via Intel® i225, 2.5GbE capable (NBase-T)
- Expansion: 4x PCIe Gen3 lanes without SERDES, configurable as 4x1 or 1x2 + 2x1; 6x Hi-Speed USB, 2x USB at 10 Gbps
- Security: TPM SLB 9670 (Q2.0), SPI1 general-purpose SPI
Typical Applications
The SOM-SMARC-TWL is suited for embedded platforms that combine compact x86 processing with multiple displays and network interfaces, for example within System-on-Modules (SOM/CoM) for industrial and HMI applications, as well as in industrial vision and edge AI thanks to its integrated MIPI CSI-2 camera inputs.
Note for Development
The RE08-G842-2121-C3 variant is designed for the commercial operating temperature range. A matching SMARC carrier board and development kits are offered separately by Seco. For design-in support, samples and project pricing, contact Atlantik Elektronik.
Downloads & documentation
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