System-on-Modules (SOM/CoM)
System-on-modules (SOM/CoM) combine processor, memory and power management into a validated compute module – the foundation for series products in your own form factor. The critical high-speed design is already solved; your carrier board defines interfaces and mechanics. See also: Carrier & Development Boards to get started and our Development Services for custom carrier design.
Thundercomm - AI Mini PC G1
- General customers with AI needs
- Budget-sensitive customers
- AI Art Generation Industry
- Natural Language Processing (NLP)
- Behavioral Analytics System in Intelligent Security Surveillance
- Scenarios requiring high NPU performance but moderate CPU requirements
Highlights
- Latest Qualcomm Snapdragon X Plus SoC with 8-core CPU
- 45 TOPS of NPU computing power
- Small form factor design, only 12cm x 12cm x 3.4cm
Thundercomm - AI Mini PC G1 Elite
- High-computing-power edge box designed for scenarios with demanding requirements for CPU, GPU, and NPU performance
- 3D modeling
- High-end game development
- Medical Imaging and Diagnostics
- Scenarios requiring high performance for both CPU and NPU
Highlights
- Latest Qualcomm Snapdragon X Elite SoC with 12-core CPU
- SoC variations from high-end X Elite 84-100, to mid-end X Plus 66-100, to low-end X 26-100
- 45 TOPS of NPU computing power
Thundercomm - AI Mini PC G1 IoT
- Retail terminal
- IoT control
- Automation control
- Smart manufacturing production line
Highlights
- Multiple OS support: Windows 11 IoT
- Fan/Fanless design
- The only WOA(Windows On Arm) box on the market featuring Qualcomm® QCS6490 + Windows
Thundercomm - AI Mini PC G1 IoT Fanless
- Retail terminal
- IoT control
- Automation control
- Smart manufacturing production line
Highlights
- Multiple OS support: Windows 11 IoT
- Fan/Fanless design
- The only WOA(Windows On Arm) box on the market featuring Qualcomm® QCS6490 + Windows
Thundercomm - TurboX - C6490P Development Kit
Thundercomm - TurboX C410 SOM
Thundercomm - TurboX C5430 SOM
- Qualcomm® QCS5430
- 4K@60FPS video decoding and 4K@30FPS video encoding
- Peripheral interfaces: GPIO, UART, I2C, I3C, SPI, USB 3.1 and PCIe
Thundercomm - TurboX C6490 Development Kit
- 5G Smart Module Development Kit for C6490 (QCs6490 / QCM6490)
Thundercomm - TurboX C6490 System on Module
- Smart Module based on Qualcomm QCS6490
Thundercomm - XR2 VR HMD
Thundercomm TurboX I615 Development Kit
- Development kit based on the Thundercomm TurboX I615 platform
- Designed for edge AI and embedded vision applications
- Rich set of interfaces for cameras, sensors and peripherals
- Enables fast prototyping and evaluation
- Supports modern Linux and Android software stacks
- Suitable for industrial, robotic and smart device designs
Thundercomm TurboX I615 SOM
- High-performance System-on-Module for embedded and edge AI
- Designed for industrial and scalable production designs
- Supports AI workloads, embedded vision and IoT applications
- Compact SOM format for fast integration
- Long-term availability and professional software support
TurboX C6690 System-on-Module (SOM)
TurboX C6690 System-on-Module (SOM) integrates a high-performance and power-efficient Qualcomm Dragonwing™ QCS6690 4nm SoC. This SOM delivers up to 6 TOPS AI computing power, 4K@60 fps video encoding, 4K@120 fps video decoding, 3 ISPs with 4 MIPI CSI interfaces, and rich external interfaces (GPIO, UART, I2C, I3C, SPI, USB 3.1, PCIe). TurboX C6690 SOM is a high-performance IoT intelligent module that can be used in the industrial handheld device, industrial tablet, edge computing, and POS. Customers can use its hardware interfaces and SDK for functional verification and rapid prototyping.
TurboX C7790 Development Kit
- Concept: High-performance development kit for edge AI, vision, and multimedia applications with strong on-device intelligence
- Configuration: Based on Qualcomm® Dragonwing™ Q-7790 with 24 TOPS AI, octa-core CPU, Adreno 722 GPU, triple ISP, and rich high-speed I/O for camera, display, and networking designs
- Use case: Suitable for rapid evaluation, prototyping, and product development in smart cameras, video collaboration, embedded vision, HMI, and multimedia edge systems
- Development focus: Combines local AI acceleration, advanced multimedia processing, and development-friendly interfaces for product-oriented edge AI designs
- Design note: Align camera setup, MIPI display integration, HDMI signal paths, storage expansion, and wireless/network architecture with the target design before release
TurboX C8750 Development Kit
- Flexible displays: 1× HDMI OUT (4K), 1× DisplayPort 1.4 over USB-C, additional HS connector
- Audio-ready: 2× speaker-out, 3.5-mm jack, HDMI IN/OUT with audio (via I²S), 2× DMIC (up to 8 DMICs)
- Camera options: 2× 4-lane D-PHY (one for ASE camera), 2× 3-trio C-PHY (compatible with 4-lane D-PHY), 2× GMSL
- Plenty of I/O: USB 3.1 Type-C, 3× USB 3.0 Type-A, 2× Micro-USB (debug), TF slot, SIM slot, fan header
- Networking & wireless: 2× 1000M Ethernet, M.2 slot for Thundercomm 5G module, SDIO Wi-Fi 5 module
- Sensors: A+G sensor (accelerometer+gyro) and magnetometer, 5× LEDs
- Industry-ready: −35…+75 °C, dimensions 201×162.5×35.6 mm
TurboX C8750 System on Module
- Next-gen compute: Oryon™ CPU (up to 1.5× vs. previous gen)
- Edge-AI power: 8th-gen AI engine (up to 10× vs. previous gen)
- Graphics & video: ~3× GPU uplift; 4K240/8K60 decode, 4K120/8K30 encode, AV1 decoder
- Imaging: triple ISP, up to 3 × 48 MP @ 30 FPS; HW sHDR, ASE
- Virtualization: hypervisor with trusted VMs (TVMs)
- Displays: on-device 4K@60 & QHD+@240; external 8K@30 & 1080p@240
- Industrial-ready: −35…+75 °C, LGA 39×33×2.75 mm
Choosing the right SOM
- Connection type: standardised (SMARC, Qseven, OSM) for second-source options – or board-to-board/LGA for the most compact designs
- Long-term availability: the first purchasing criterion for SOMs – filterable by the availability commitment of the manufacturer roadmap
- Compute & AI: processor platform, NPU class and memory configuration to match the target application
- Environment: industrial temperature range and certifications for series deployment
Design-in support from our FAEs
We support module selection, carrier board design, BSP adaptation and lifecycle planning – from prototype to series production. Contact our team.
Developer FAQs
Standard format or board-to-board – which to choose?
Standards such as SMARC or Qseven make second-source strategies and carrier reuse easier. Board-to-board or LGA modules allow more compact, cost-optimised designs but tie you to the module family.
Where do I get the carrier board?
For evaluation, from our Carrier & Development Boards category. For production, you design your own carrier – or our development services team takes it on for you.
How is long-term availability secured?
We plan lifecycle, PCN/EOL communication and successor options with you early on – based on manufacturer roadmaps, to which we have direct access as an official distributor.
Not found the right product?
Our portfolio is larger than the web shop. Tell us your requirement – we will find the right platform, across all manufacturers.