Qualcomm

MPN: EVK-IQ8275-Starter-2Manufacturer: Qualcomm

• Evaluation kit for Dragonwing IQ-8275: Development platform for industrial IoT, edge AI and robotics applications.
• AI acceleration: Qualcomm® Hexagon™ Tensor Processor with up to 40 dense TOPS AI performance.
• High-performance platform: Octa-core CPU, 12 GB LPDDR5 with link ECC and 128 GB UFS storage.
• Camera and vision support: Processing of up to three concurrent 4K video streams and 3x MIPI CSI C/D-PHY flex connectors.
• Connectivity: Onboard Wi-Fi 6E, Bluetooth® 5.3, RJ45 2.5 GbE, PCIe x4 and M.2 E-Key.
• Display and multimedia interfaces: 2x mini-DP, DSI flex connection, 4K video decode and 2x 4K video encode.
• Embedded Linux support: Ubuntu and Upstream Linux with Yocto support for prototyping and production-oriented embedded development.

DEV BOARD QCC5171 MODULE ONLY

DEV BOARD QCC5181 MODULE ONLY

Manufacturer: QualcommMPN: DK-QCC3026-WLCSP81-A-0

Development Kit for the Qualcomm QCC3026 Bluetooth Audio SoC

Manufacturer: QualcommMPN: DK-QCC5121-WLCSP81-A-0

Development Kit for the Qualcomm QCC5121 Bluetooth Audio SoC

Manufacturer: QualcommMPN: DK-TRBI200-CE684-1

• ​TRANSACT. Brdg  I/F High-Speed, Debug  Adaptor / Programmer

æEnergy LowCost SPI Prog. SensorKit

Manufacter: Qualcomm
MPN: IQ615

The Qualcomm IQ6 Series delivers powerful industrial-grade performance across a wide temperature range, offering efficient compute capabilities, AI workload processing, and rich peripheral support, including Wi-Fi, Ethernet, and USB, tailored for industrial devices in the entry and mid-tier segments.
 

Manufacturer: QualcommMPN: IQ8275

The Qualcomm IQ8 Series powers compute-heavy and AI-based devices and is designed to operate in an expanded temperature range. It features built-in safety functions and rich peripheral support, ensuring powerful and efficient workload processing in demanding industrial environments.

Manufacturer: QualcommMPN: IQ8300

The Qualcomm IQ8 Series powers compute-heavy and AI-based devices and is designed to operate in an expanded temperature range. It features built-in safety functions and rich peripheral support, ensuring powerful and efficient workload processing in demanding industrial environments.

Manufacturer: QualcommMPN: IQ-9075

The Qualcomm IQ9 Series delivers unmatched on-device AI performance for the most demanding industrial applications. It features built-in safety mechanisms and a flexible design that allows for high-compute, power-efficient performance, capable of handling heavy workloads in extreme environments. The Qualcomm IQ9 Series offers industrial-grade AI performance of up to 100 TOPS, specifically designed for the most demanding industrial and robotics applications. By combining power efficiency with integrated safety features such as ECC (Error Correction Code) memory and a dedicated safety island or real-time subsystem for its edge AI capabilities, the Qualcomm IQ9 Series is ideally suited for extreme operating conditions ranging from -40°C to +115°C.

Manufacturer: QualcommMPN: IQ-9100

The Qualcomm IQ9 Series delivers unmatched on-device AI performance for the most demanding industrial applications. It features built-in safety mechanisms and a flexible design that allows for high-compute, power-efficient performance, capable of handling heavy workloads in extreme environments. The Qualcomm IQ9 Series offers industrial-grade AI performance of up to 100 TOPS, specifically designed for the most demanding industrial and robotics applications. By combining power efficiency with integrated safety features such as ECC (Error Correction Code) memory and a dedicated safety island or real-time subsystem for its edge AI capabilities, the Qualcomm IQ9 Series is ideally suited for extreme operating conditions ranging from -40°C to +115°C.

Manufacturer: QualcommMPN: QCC711

• Advanced hardware-based security subsystem
• Dedicated application microcontroller
• Dedicated Bluetooth microcontroller
• User-friendly development environment and tools

Manufacturer: QualcommMPN: QCC-730-1-WLPSP90-MT-01-0

Qualcomm® QCC730 is an industry-leading 1x1 Wi-Fi 4 transceiver built to deliver ultralow micro-power Wi-Fi, flexibility to scale, and versatility for ease of design. The selectable power modes and innovative power management allows for exponential battery life for battery-powered or energy-harvested IoT. QCC730 will be complemented by an open-source SDK with a software stack that supports cloud connectivity offloading for a comprehensive solution. It’s direct cloud connectivity empowers developers with an alternative to traditionally Bluetooth-only applications.

Manufacturer: QualcommMPN: QCS-410-0-PSP806-TR-01-0-AC

• Dual 14-bit Qualcomm Spectra™ 250L ISP capable of supporting up to 21MP at 30fps
• ​Qualcomm® Adreno™ 612 GPU with 64-bit addressing @ up to 845MHz with latest API support
• Qualcomm® Hexagon™ DSP with dual hexagon vector extensions for running DNN models and advanced Qualcomm® Neural Processing Engine SDK support
• Quad-core Qualcomm® Kryo™ 460 CPU optimized for power and DMIPS
• Qualcomm AI Engine designed to support accelerated on-device machine learning

Manufacturer: QualcommMPN: QCS-5430-1-PSP1287-TR-00-0-AA

These next generation, premium software defined Systems-on-a-Chip (SoC)s deliver superior system performance, exceptional compute and best-in-class connectivity. The scalable performance of these SoCs is designed to deliver superior features and performance across all dimensions of IoT, specifically for Robotics, Industrial Handhelds (IHH), Retail, Cameras, and Drone applications. This includes support for Wi-Fi 6E for ubiquitous coverage, a unified software stack, powerful AI and expanded interfaces across ecosystems.

Manufacturer: QualcommMPN: QCS-610-0-PSP806-TR-01-0-AC

• Dual 14-bit Qualcomm Spectra™ 250L ISP capable of supporting up to 24MP at 30fps
• Qualcomm® Adreno™ 612 GPU with 64-bit addressing @ up to 845MHz with latest API support
• ​Qualcomm® Hexagon™ DSP with dual hexagon vector extensions for running DNN models and advanced Qualcomm® Neural Processing Engine SDK support
• Octa-core Qualcomm® Kryo™ 460 CPU optimized for power and DMIPS
• Qualcomm AI Engine designed to support accelerated on-device machine learning

Manufacturer: QualcommMPN: QCS8550

- Qualcomm® Kryo™ CPU; 64-bit architecture:
  - 1 Prime core, up to 3.36 GHz with Arm® Cortex®-X3 technology
  - 4 Performance cores, up to 2.8 GHz
  - 3 Efficiency cores, up to 2.0 GHz
- Support for LP-DDR5x memory up to 4200 MHz:
  - Memory Density: up to 16 GB
- Qualcomm® Adreno™ 740 GPU
- Concurrent GPS, Glonass, BeiDou, Galileo, QZSS, NavIC
- Sensor-Assisted Positioning 6.0
- EVA: Computer vision processor for improved video denoising, digital video stabilization, and image correction adjustment
- Qualcomm Spectra™ Image Signal Processor:
  - Cognitive ISP, Triple 18-bit ISPs
  - Up to 36 MP triple camera @ 30 FPS ZSL
  - Up to 64+36 MP dual camera @ 30 FPS ZSL
  - Up to 108 MP single camera @ 30 FPS ZSL
  - Up to 200 MP Photo Capture
- NPU: Qualcomm® Hexagon™ Tensor Processor (HTP) with Hexagon Vector eXtensions (HVX) and Hexagon Matrix eXtensions (HMX)
- Qualcomm Aqstic™ audio codec:
  - Qualcomm Aqstic smart speaker amplifier
  - Total Harmonic Distortion + Noise (THD+N), Playback: -108dB
  - Qualcomm® Audio and Voice Communication Suite
- Extended life for hardware and software support

Manufacturer: QualcommMPN: RB3-RK

Manufacturer: QualcommMPN: CSR8350A07-ABBC-R

The CSR8350 is a Bluetooth 4.1 single-chip solution with aptX and cVc support for high-quality audio in automotive and navigation systems.