Thundercomm

• Integrated 24 TOPS AI accelerator
• 4K@60fps with HDR support
• Compact 49.9g wearable design
• IP68 waterproof (10m)
• Ultra-low power architecture
• Optimized for AI-driven imaging

• Concept: High-performance development kit for edge AI, robotics, and computer vision designs based on the Qualcomm Dragonwing™ QCS8550
• Configuration: Core kit variant with 48 TOPS AI performance, Adreno™ 740 GPU, Spectra™ 680 ISP, 12 GB LPDDR5x, 128 GB UFS 3.1, and 96Boards-compatible high-speed and low-speed expansion
• Use case: Suitable for service robotics, deep learning, face detection, object detection and avoidance, surveillance, and industrial or automation applications
• Development focus: Fast evaluation of AI, vision, multimedia, and sensor workloads on a high-performance edge-computing platform
• Design note: Core Kit serves as the base configuration for AI and I/O development; the subsequent Vision Kit expands this platform specifically with CSI camera hardware

Manufacturer: Thundercomm

MPN: Qualcomm® RB5 Gen 2 Development Kit (Vision Kit)

• Concept: Vision-oriented high-performance development kit for edge AI, robotics, and computer vision designs based on the Qualcomm Dragonwing™ QCS8550
• Configuration: Vision kit variant built on the RB5 Gen 2 Core Kit, extended with a CSI camera bracket, high-resolution CSI camera, and low-resolution CSI camera
• Use case: Suitable for computer vision, service robotics, deep learning, face detection and recognition, object detection and avoidance, and surveillance applications
• Development focus: Direct entry into vision-centric AI workloads with included camera hardware for evaluation, prototyping, and application-oriented validation
• Design note: Compared with the Core Kit, the Vision Kit is the more suitable option when image sensors and CSI-based vision pipelines are part of the development setup from the outset

Manufacturer: ThundercommMPN: Rubik Pi 3

• Complete vision and AI development kit for real-world conditions
• Combines Rubik Pi 3 edge AI platform with ToF i200 depth camera
• 12.5 TOPS AI performance at the edge
• Sunlight-robust 3D depth sensing
• Ideal for robotics, autonomy and industrial perception
• Accelerates prototyping and time-to-market

• General customers with AI needs
• Budget-sensitive customers
• AI Art Generation Industry
• Natural Language Processing (NLP)
• Behavioral Analytics System in Intelligent Security Surveillance
• Scenarios requiring high NPU performance but moderate CPU requirements

• Latest Qualcomm Snapdragon X Plus SoC with 8-core CPU
• 45 TOPS of NPU computing power
• Small form factor design, only 12cm x 12cm x 3.4cm

• High-computing-power edge box designed for scenarios with demanding requirements for CPU, GPU, and NPU performance
• 3D modeling
• High-end game development
• Medical Imaging and Diagnostics
• Scenarios requiring high performance for both CPU and NPU

• Latest Qualcomm Snapdragon X Elite SoC with 12-core CPU
• SoC variations from high-end X Elite 84-100, to mid-end X Plus 66-100, to low-end X 26-100
• 45 TOPS of NPU computing power

• Retail terminal
• IoT control
• Automation control
• Smart manufacturing production line

• Multiple OS support: Windows 11 IoT
• Fan/Fanless design
• The only WOA(Windows On Arm) box on the market featuring Qualcomm^® QCS6490 + Windows

• Retail terminal
• IoT control
• Automation control
• Smart manufacturing production line

• Multiple OS support: Windows 11 IoT
• Fan/Fanless design
• The only WOA(Windows On Arm) box on the market featuring Qualcomm^® QCS6490 + Windows

• Premium performance with super high AI computing power
• Deeply optimized streaming media AI analysis service
• Visual configuration of AI algorithms and applications
• One-site management through End-edge-cloud
• Industrial design for harsh conditions
• Flexible expansion of rich interfaces